Solid-State Imaging Device A/D Conversion Noise Isolation
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Solution Overview
Problem
The existing solid-state imaging devices face limitations in layout due to the limited available region for A/D conversion, leading to noise interference during signal transfer due to simultaneous count operations across all columns, affecting the accuracy of signal reading.
Innovation Solution
The solution involves separating counter and memory units across different substrates, allowing for simultaneous transfer of signals without noise interference by using connection units like bumps to connect counter units to corresponding memory units, enabling efficient high-speed signal reading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If counter units and memory units are arranged close together to save layout space, then the available layout region is efficiently utilized, but noise interference occurs during signal transfer and signal quality deteriorates
Solution Approach 1:
The patent divides the A/D conversion circuit into separate functional blocks: counter units and memory units, and places them in different physical locations within the substrate. This segmentation allows signal transfer to occur over longer distances without noise interference, while still maintaining efficient layout utilization through structured arrangement of the divided components.
Solution Approach 2:
The patent introduces intermediate signal transfer paths and control circuits that mediate between counter units and memory units. These intermediaries enable isolated signal transfer, preventing direct noise coupling between adjacent components while maintaining functional connectivity across the circuit.
2Object-affected harmful factors
If counter units and memory units are separated across different substrates, then noise interference is reduced and signal quality improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent utilizes three-dimensional substrate stacking architecture, placing counter units on one substrate layer and memory units on another substrate layer. This dimensional separation physically isolates noise sources while maintaining compact form factor, avoiding the need for lateral expansion that would increase device footprint complexity.
Solution Approach 2:
The patent implements nested substrate structures where multiple functional layers are integrated within a compact stacked configuration. The counter units and memory units are nested across different substrate layers with interconnection structures, achieving noise isolation while maintaining manufacturing feasibility through standardized multi-layer packaging techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces noise influence during signal transfer and enables high-speed signal reading by separating counter and memory units across substrates, improving the robustness and accuracy of the imaging device.
Implementation Method 1
The pixel 1006 has a photoelectric conversion element for converting incident light into an electric signal and generates a pixel signal
Implementation Method 2
a connection unit configured to connect each of the plurality of counter units to a corresponding one of the plurality of memory units and simultaneously transfer the count signals from at least two counter units to at least two memory units
Data Source
AI summary
A solid-state imaging device includes: a first substrate; a second substrate; a pixel unit in which pixels are disposed in a matrix; and an A/D conversion unit that is disposed for every columns of the pixels and counts a count clock for only a period according to a magnitude of the pixel signal. The A/D conversion unit includes: counter units that is provided in one of the first substrate and the second substrate and generates n-bit count signals; memory units that is provided in the other of the first substrate and the second substrate and holds the count signals and outputs the held count signals to horizontal signal transfer lines; and a connection unit that connects each counter unit to a corresponding one of the memory units and simultaneously transfer the count signals from at least two counter units to at least two memory units.