Imaging Device Adhesive Structure for Peeling Resistance
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Solution Overview
Problem
Conventional techniques for bonding silicon and glass substrates in solid-state imaging devices face limitations in achieving optimal characteristics for moisture resistance and bonding strength, particularly in the WCSP process.
Innovation Solution
An imaging device configuration that includes a sensor substrate with a transparent sealing member and two adhesive members, where the first adhesive member is used in the effective pixel area and a higher rigidity second adhesive member is used in the outer peripheral region, with a specific adhesive strength ratio to enhance bonding and prevent peeling, and a manufacturing method to form these adhesive members accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single adhesive member is used to bond the sensor substrate and sealing member, then the manufacturing process is simple, but the bonding strength and moisture resistance are insufficient
Solution Approach 1:
The adhesive structure is divided into two distinct adhesive members: a first adhesive member with lower rigidity for the effective pixel area, and a second adhesive member with higher rigidity for the outer peripheral region. This segmentation allows each adhesive member to be optimized for its specific functional requirements, improving overall bonding strength and moisture resistance without requiring a completely complex redesign
Solution Approach 2:
Different adhesive members with different rigidity characteristics are applied to different regions of the sensor substrate. The first adhesive member (lower rigidity) is used in the effective pixel area where flexibility is needed, while the second adhesive member (higher rigidity) is used in the outer peripheral region where structural support and moisture sealing are critical. This local differentiation optimizes performance for each region's specific requirements
2Reliability
If a transparent member is bonded to improve moisture resistance, then moisture resistance improves, but light receiving characteristics may deteriorate
Solution Approach 1:
The sealing member is designed with different transparency characteristics for different regions: the portion corresponding to the effective pixel area has high transparency to allow maximum light transmission, while the outer peripheral region can have lower transparency since it does not affect light receiving. This local quality differentiation maintains moisture resistance while preserving light receiving characteristics
Solution Approach 2:
The sealing function is segmented into two regions: the effective pixel area region where light transmission is critical, and the outer peripheral region where moisture sealing is critical. The first adhesive member and second adhesive member are positioned to serve these different functions, allowing the sealing member to be optimized for both transparency and moisture resistance simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the imaging device's light receiving characteristics and peeling resistance, achieving better performance and reliability by optimizing the adhesive strength and material selection for the sealing and reinforcing resins.
Implementation Method 1
a first adhesive member that bonds the sensor substrate and the sealing member in an area including at least the effective pixel area
Implementation Method 2
a second adhesive member that bonds the sensor substrate and the sealing member in an outer peripheral region located outside the effective pixel area in a planar view, and has higher rigidity than the first adhesive member
Data Source
AI summary
The present disclosure relates to an imaging device, a manufacturing method, and an electronic apparatus. An imaging device includes: a sensor substrate with an effective pixel area; a transparent sealing member that seals a surface of the sensor substrate; a sealing resin that bonds the sensor substrate and the sealing member; and a reinforcing resin that bonds the sensor substrate and the sealing member. A product of adhesive strength per unit area of the sealing resin and the reinforcing resin in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the sealing resin in the effective pixel area and an area of a part bonded in the effective pixel area. The present technology can be applied to, for example, a CMOS image sensor of WCSP.