Solid-State Imaging Device Connection Pitch Optimization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The demand for further miniaturization of solid-state imaging devices is not adequately addressed by existing technologies, which face challenges in reducing defects in electrical connections and improving yield due to limitations in the arrangement and pitch of control and readout connections between substrates.
Innovation Solution
A solid-state imaging device configuration that includes a first substrate with pixels and control signal lines, a second substrate with control and readout signal lines, and a connection portion with control and readout connections, where the number and arrangement of connections are optimized to increase pitch and reduce defects, allowing for improved electrical connections and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of control connections between substrates is reduced, then the pitch between connections increases and defects are reduced, but the connectivity and signal transmission capability deteriorates
Solution Approach 1:
The connection portion is segmented into two distinct types: control connections for control signals and readout connections for pixel signals. This segmentation allows each connection type to be optimized independently, with control connections arranged to minimize defects while readout connections arranged to maximize signal transmission capability.
Solution Approach 2:
The patent utilizes the vertical dimension by laminating multiple substrates, allowing control connections to be arranged on the first substrate while readout connections are arranged on the second substrate. This dimensional separation resolves the conflict between reducing connection density and maintaining connectivity.
2Volume of moving object
If substrates are miniaturized to reduce device size, then the overall device dimensions are reduced, but the arrangement and connectivity of signal lines between substrates becomes more difficult
Solution Approach 1:
By segmenting the connection functions into control connections and readout connections on different substrates, the patent enables independent optimization of each connection type's arrangement, making it feasible to implement precise signal line routing even in miniaturized devices.
Solution Approach 2:
The connection portion acts as an intermediary structure between the first and second substrates, providing dedicated pathways for both control and readout signals. This intermediary arrangement facilitates precise signal line connectivity while maintaining compact device dimensions through vertical stacking.
Data Source
AI summary
In a solid-state imaging device, a first substrate has a plurality of pixels and a plurality of first control signal lines. The plurality of first control signal lines are connected to pixels of each row. The second substrate includes a plurality of second control signal lines and a control circuit. The arrangement of each of the plurality of second control signal lines on the second substrate corresponds to the arrangement of a corresponding one of the plurality of first control signal lines on the first substrate. The connection portion has a plurality of control connections and a plurality of readout connections. Each of the plurality of control connections is connected to one of the plurality of first control signal lines and a corresponding one of the plurality of second control signal lines.