Solid-State Imaging Device Contact Plug Arrangement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing solid-state imaging devices lack an effective method for arranging contact plugs to supply power supply voltage or ground potential to semiconductor regions in pixel arrays formed on different substrates, limiting flexibility and efficiency in voltage distribution.
Innovation Solution
A solid-state imaging device design featuring two semiconductor substrates with differently arranged contact plugs, allowing for independent supply of voltage to distinct semiconductor regions, enabling flexible and efficient voltage distribution tailored to the characteristics of each circuit element, thereby improving image quality and noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If contact plugs are arranged uniformly in pixel arrays on different substrates, then manufacturing is simplified, but voltage distribution efficiency and image quality deteriorate due to inability to suppress signal overflow and reduce noise
Solution Approach 1:
The patent applies local quality by arranging contact plugs with different densities in different regions of the pixel array. Specifically, a first density of contact plugs is used in a first region and a second density (different from the first) is used in a second region. This allows optimization of voltage distribution and signal quality in different areas while maintaining manufacturing feasibility through a systematic arrangement pattern.
2Device complexity
If the same number of contact plugs are used in both substrates, then device symmetry is maintained, but voltage distribution flexibility and noise reduction capability are limited
Solution Approach 1:
The patent implements asymmetry by deliberately using different numbers of contact plugs on the first substrate versus the second substrate. The first substrate has a first number of contact plugs while the second substrate has a second number of contact plugs, where the first number differs from the second number. This asymmetric configuration enables flexible voltage distribution tailored to the specific circuit requirements of each substrate, improving adaptability for noise reduction and signal optimization.
Data Source
AI summary
A solid-state imaging device including two semiconductor substrates arranged in layers is provided. Each semiconductor substrate has a semiconductor region in which a circuit constituting a part of a pixel array is formed. The circuits in the two semiconductor substrates are electrically connected to each other. Each semiconductor substrate includes one or more contact plugs for supplying a voltage to the semiconductor region. The number of the contact plugs of one semiconductor substrate in the pixel array is different from the number of the contact plugs of the other semiconductor substrate in the pixel array.