Solid-State Imaging Device Electrostatic Protection Circuit Layout
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Solution Overview
Problem
In solid-state imaging devices, existing electrostatic protection circuits often overlap substrate connecting portions, leading to potential stress and changes in electrostatic discharge resistance during substrate bonding, which can affect the reliability and efficiency of the imaging system.
Innovation Solution
The electrostatic protection circuit is positioned to not overlap any substrate connecting portions when viewed in the lamination direction, allowing for a compact design that maintains effective electrostatic discharge resistance without excessive stress, thereby improving the reliability and efficiency of the imaging system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the electrostatic protection circuit is positioned to overlap substrate connecting portions, then the device area is reduced, but the electrostatic discharge resistance changes due to stress during substrate bonding
Solution Approach 1:
The patent transitions from a two-dimensional overlap arrangement to a three-dimensional staggered arrangement where the electrostatic protection circuit and substrate connecting portions are positioned at different lateral positions. This dimensional reorganization eliminates stress interference while maintaining compact device area through vertical integration.
Solution Approach 2:
The electrostatic protection circuit is extracted from the overlapping region with substrate connecting portions and positioned in a separate area. This separation removes the harmful stress effect while the circuit remains functionally integrated into the device through electrical connections.
2Reliability
If the electrostatic protection circuit does not overlap substrate connecting portions, then the electrostatic discharge resistance is maintained, but the device area increases
Solution Approach 1:
The patent merges the electrostatic protection circuit with other device structures in a staggered configuration, allowing non-overlapping placement that maintains ESD resistance while utilizing shared substrate space efficiently to minimize overall device area.
Solution Approach 2:
The layout configuration is optimized to allow flexible positioning of the electrostatic protection circuit in non-overlapping regions, adapting the arrangement to maintain reliability while controlling area through dynamic spatial optimization rather than fixed overlapping placement.
3Ease of manufacture
If substrate connecting portions are positioned to overlap the electrostatic protection circuit, then the manufacturing process is simplified, but the electrostatic protection circuit experiences stress and resistance changes
Solution Approach 1:
The patent segments the device layout into distinct functional regions where substrate connecting portions and electrostatic protection circuits are laterally separated. This segmentation prevents stress interference while maintaining manufacturing simplicity through standardized non-overlapping placement rules.
Solution Approach 2:
The patent introduces an intermediary spatial arrangement where substrate connecting portions and electrostatic protection circuits are positioned at offset locations. This intermediary positioning acts as a mediator that maintains both manufacturing ease and electrical performance by eliminating direct overlap and stress exposure.
Data Source
AI summary
A solid-state imaging device includes a first substrate, a second substrate, an electrode portion, a first substrate connecting portion, an electrostatic protection circuit, and a second substrate connecting portion. A photoelectric conversion element is disposed on the first substrate. A part of the peripheral circuit is arranged on the second substrate. The electrode portion has a connection surface. The first substrate connecting portion electrically connects the electrode portion and the second substrate. The electrostatic protection circuit is connected to a circuit between the first substrate connecting portion and the peripheral circuit. The second substrate connecting portion electrically connects the peripheral circuit and the photoelectric conversion element. The electrostatic protection circuit is disposed at a position such that the electrostatic protection circuit does not overlap any of the first substrate connecting portion and the second substrate connecting portion.