Imaging Device Metal Plate Shielding for EMI Reduction
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Solution Overview
Problem
Imaging devices face picture or video interference due to external noise in strong electric field environments, with existing solutions either increasing device size, reducing light quality, or complicating the internal configuration, making miniaturization difficult.
Innovation Solution
An imaging device design that includes a metallic mount for the imaging element, a metal plate between the imaging element and the main circuit board, and an exposed GND connection on the imaging element flexible cable, connected via a conductive elastic part, to reduce electromagnetic interference without compromising image quality or increasing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a cover consisting of an electrically conductive medium is used to shield the imaging device, then electromagnetic wave interference is reduced, but the imaging device becomes larger and more troublesome to handle
Solution Approach 1:
The shielding function is segmented from a comprehensive device cover to a localized metal plate positioned specifically between the imaging element and main circuit board. This segmentation allows electromagnetic shielding to be achieved at the critical interference path without enclosing the entire device, thus reducing overall device size while maintaining shielding effectiveness.
Solution Approach 2:
Instead of providing uniform shielding throughout the entire device, the invention applies shielding locally at the specific location where electromagnetic interference occurs most intensely - between the imaging element and main circuit board. This localized approach reduces the volume of shielding material needed while effectively addressing the primary interference source.
2Object-affected harmful factors
If an electrically conductive filter is added to the lens surface to shield against strong electric field noise, then electromagnetic wave interference is reduced, but the amount of light entering the lens is reduced and image quality deteriorates
Solution Approach 1:
A metal plate is introduced as an intermediary shielding element positioned between the imaging element and main circuit board, away from the optical path. This intermediary provides electromagnetic shielding without intercepting light rays, unlike a filter on the lens surface which would directly block light and degrade image quality.
Solution Approach 2:
The shielding approach is moved from the optical dimension (lens surface) to the electrical dimension (between circuit boards). By placing the metal plate in the electrical signal path rather than the optical path, the invention achieves electromagnetic shielding without affecting light transmission and image quality.
3Object-affected harmful factors
If shielding is formed along the periphery of the imaging elements, then electromagnetic wave interference is reduced, but the internal configuration becomes complicated and miniaturization becomes difficult
Solution Approach 1:
The shielding function is merged with the existing structural components - the metal plate is integrated into the assembly between the imaging element and main circuit board, utilizing the existing spatial relationship and mounting structures. This merging eliminates the need for separate peripheral shielding structures, simplifying the internal configuration while maintaining shielding effectiveness.
Solution Approach 2:
The metal plate serves multiple functions: it provides electromagnetic shielding, maintains structural spacing between components, and can be integrated with existing mounting mechanisms. This multi-functionality reduces the need for additional dedicated shielding structures, thereby simplifying the overall internal configuration and facilitating miniaturization.
4Object-affected harmful factors
If heat dissipation plate is connected to main board using electrically conductive elastic members, then electromagnetic wave interference is reduced, but stress is applied on imaging elements causing tilt and image quality deterioration
Solution Approach 1:
Instead of using elastic members that physically contact and stress the imaging element, the invention uses a rigid metal plate that copies or replicates the shielding function without applying mechanical stress. The metal plate provides electromagnetic shielding through its conductive properties alone, eliminating the need for elastic deformation and contact stress on the imaging element.
Solution Approach 2:
The mechanical elastic connection system is replaced with a rigid structural plate system. The metal plate provides electromagnetic shielding through its material properties rather than through mechanical elastic deformation, thereby eliminating the stress and tilt issues caused by elastic members while maintaining shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces picture or video interference caused by external noise in strong electric field environments while maintaining image quality and achieving miniaturization through a simple internal configuration.
Implementation Method 1
a metal plate disposed between the imaging element and the main circuit board... capable of reducing picture (or video) interference caused by external noise
Implementation Method 2
fluctuation of the ground ('GND') potential of imaging element flexible cables due to the influence of external electromagnetic waves... the imaging element flexible cable includes an imaging element flexible cable GND which has a ground potential
Data Source
AI summary
An imaging device of the present invention, which is an imaging device for shooting images or video of a photographic subject, includes: an imaging element for taking an optical image of the photographic subject and generating image data therefrom; a main circuit board for conducting signal processing on the image data generated by the imaging element; an imaging element flexible cable that is connected to the main circuit board and on which the imaging element is mounted; a mount for fixing the imaging element and that includes a metallic component; a metal plate disposed between the imaging element and the main circuit board. The imaging element flexible cable includes an imaging element flexible cable GND which has a ground potential, and the imaging element flexible cable GND is connected to the metal plate.