Imaging Device Metal Plate Shock Absorption
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Solution Overview
Problem
In digital cameras with interchangeable lenses, the increased lens weight and miniaturization of the device cause the center of gravity to shift, making them prone to falling on the lens side, which can damage the semiconductor on the circuit board due to strong vibrations during a drop.
Innovation Solution
An imaging device design that includes a metal plate between the imaging unit and the circuit board, with a first portion in mechanical contact with the semiconductor device and two bent portions parallel to the optical axis, providing increased bending stiffness and indirect mechanical contact to mitigate shock deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the lens weight is increased for miniaturization, then the imaging device can be made more compact, but the center of gravity shifts to the lens side making the device prone to falling and damaging the semiconductor
Solution Approach 1:
The patent applies beforehand cushioning by providing a cushioning member (such as a rubber or foam material) positioned between the circuit board and the housing. This cushioning member is installed in advance to absorb and mitigate the impact forces when the imaging device falls on the lens side, preventing direct transmission of shock to the semiconductor and circuit board, thereby protecting against damage while maintaining the compact design
2Stability of the object's composition
If an additional support member is provided to increase rigidity, then the circuit board stability is improved, but the device complexity increases
Solution Approach 1:
The patent merges the support function with the existing housing structure by integrating the cushioning member into the housing design. Instead of adding a separate support member that would increase complexity, the cushioning function is combined with the housing's existing structural elements, providing both support and protection while maintaining simplicity in the overall device architecture
Data Source
AI summary
An imaging device according to the present disclosure includes: an imaging unit that is housed in an outer case and captures an image of an object; a circuit board that is disposed on a back side in the outer case and includes a semiconductor device mounted thereon for processing a signal from the imaging unit; and a metal plate that is disposed between the imaging unit and the circuit board in the outer case and is fixed to the outer case. The metal plate has a first portion opposite to the circuit board and brought into mechanical contact with the semiconductor device through a contact member, and at least two second portions formed integrally with the first portion and bent in an optical axis direction of the imaging unit.