Solid-State Imaging Device Moisture-Resistant Sealing
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Solution Overview
Problem
Existing solid-state imaging devices for electronic endoscopes are not compact enough and lack moisture resistance, making them unsuitable for narrow biomedical applications where humidity is high, leading to potential electrical failures and short circuits.
Innovation Solution
A solid-state imaging device with a ceramic substrate, a chip size package (CSP) type solid-state imaging element, and a metal frame sealed with thermosetting epoxy resin to create a moisture-resistant package that matches the size of the imaging element, ensuring electrical reliability in humid environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solid-state imaging element is mounted in a package body, then electrical connection and protection are achieved, but the overall thickness becomes large
Solution Approach 1:
The patent merges the package body structure with the imaging element substrate by directly bonding the imaging element to the substrate without a separate mounting package. The substrate itself serves as both the mounting platform and the protective enclosure, eliminating the need for a distinct package body and thereby reducing overall device thickness while maintaining electrical connection reliability.
Solution Approach 2:
The patent extracts and eliminates the separate package body component from the traditional imaging device structure. By removing this intermediate mounting structure and directly integrating the imaging element onto the substrate, the design achieves thinner profile while preserving all necessary electrical connection functions through direct bonding techniques.
2Volume of moving object
If the imaging element is made compact and thin, then device size is reduced, but moisture resistance becomes insufficient
Solution Approach 1:
The patent employs composite material structures where the substrate integrates multiple functional layers including moisture barrier coatings, sealing materials, and conductive traces. This composite construction provides effective moisture protection while maintaining the compact and thin form factor of the imaging element, as the protective functions are built into the substrate layers rather than requiring separate bulky protective housings.
3Volume of stationary object
If the overall device size is reduced to match the imaging element size, then compactness is achieved, but moisture protection becomes compromised
Solution Approach 1:
The patent utilizes thin film moisture barrier coatings and flexible sealing structures integrated into the substrate design. These thin protective films provide effective moisture protection while adding minimal thickness, enabling the device to maintain a compact size that matches the imaging element dimensions without compromising moisture resistance. The thin film structure conformally protects all exposed surfaces of the compact device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, thin, and moisture-resistant solid-state imaging device that prevents electrical failures and short circuits, enhancing reliability and safety for use in high-humidity biomedical applications, such as narrow-diameter endoscopes.
Implementation Method 1
a metal frame sealed with thermosetting epoxy resin
Implementation Method 2
sealed with a moisture-resistant resin
Implementation Method 3
an electrode for establishing electrical contact with a bonding wire led from a pad
Implementation Method 4
a frame that seals the solid-state imaging element so as to surround outer peripheral surfaces
Data Source
AI summary
A solid-state imaging device comprises: a solid-state imaging element comprising a solid-state imaging element body; a first substrate one end face of which is bonded to and integrated with one end face of a solid-state imaging element substrate of the solid-state imaging element, the first substrate comprising on its one surface an electrode for establishing electrical contact with a bonding wire led from a pad provided on one surface of the solid-state imaging element, a frame that seals the solid-state imaging element so as to surround outer peripheral surfaces of the solid-state imaging element substrate excluding its the one end face; and a sealing resin portion that covers a region extending from a portion including the electrode on the one surface of the first substrate to a portion including the pad on the one surface of the solid-state imaging element.