Imaging Device Reinforcing Member Opening Enhances Light Sensitivity

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Solution Overview

Problem

Imaging devices with a WLCSP structure face reduced sensitivity due to light reflection and absorption by glass protective substrates, leading to increased camera module height as the optical path length is prolonged, necessitating a solution to enhance sensitivity and reduce profile.

Innovation Solution

Incorporating a reinforcing member with an opening on the semiconductor substrate, eliminating the need for a glass protective substrate, which reduces light refraction and absorption, allowing direct light entry into the light receiving section and maintaining the camera module's compactness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a glass protective substrate is provided on the imaging device, then the imaging device is protected, but light reflection and absorption occur reducing sensitivity

Engineering Contradiction:
Improveprotection of imaging deviceVSAvoidlight loss
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent removes the glass protective substrate from the imaging device structure. By extracting this component, the harmful light reflection and absorption are eliminated, thereby improving light sensitivity while maintaining device protection through alternative means such as the lens module design and sealing structures.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If a glass protective substrate is provided, then protection is achieved, but the camera module height is increased

Engineering Contradiction:
Improveprotection of imaging deviceVSAvoidcamera module height
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The glass protective substrate is extracted from the structure, directly reducing the camera module height. The protection function is maintained through alternative design approaches that do not add height, such as integrated sealing and the specific arrangement of the lens module and imaging device.

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If light passes through glass protective substrate, then protection is provided, but optical path length is prolonged

Engineering Contradiction:
Improveprotection of imaging deviceVSAvoidoptical path length
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The glass protective substrate is removed from the optical path, eliminating the prolonged optical path length caused by light refraction through glass. The imaging device maintains protection through alternative structural designs while allowing light to travel a shorter, more direct path to the light receiving section.

Inventive Principle:
Principle #2Taking out (Extraction)

4Manufacturing precision

If distance between imaging device and lens is increased to compensate for prolonged optical path, then focal plane is maintained, but camera module height is increased

Engineering Contradiction:
Improvefocal plane positioningVSAvoidcamera module height
Core Design Contradiction:
Manufacturing precisionVSLength of stationary object

Solution Approach 1:

By removing the glass protective substrate, the optical path length is reduced, allowing the imaging device to be positioned closer to the lens module while maintaining proper focal plane positioning. This extraction eliminates the need to increase camera module height to compensate for extended optical paths.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the sensitivity of the imaging device by minimizing light loss and maintaining a reduced camera module profile, as the light path is not prolonged, allowing for a more compact design without the need for increased distance between the imaging device and lens module.

Implementation Method 1

a light receiving section is formed that includes a plurality of pixels performing photoelectric conversion

Methodology Applied
Scientific EffectPhotoelectric conversion: Photoelectric Effect

Data Source

PatentUS11362123B2Imaging device, camera module, and electronic apparatus to enhance sensitivity to light
Publication Date: 2022.06.14 SONY SEMICON SOLUTIONS CORP
  • US11362123B2 patent drawing
  • US11362123B2 patent drawing
  • US11362123B2 patent drawing

AI summary

The present technology relates to an imaging device, a camera module, and an electronic apparatus that make it possible to reduce a profile of the camera module and to enhance sensitivity. The imaging device includes: a semiconductor substrate in which a light receiving section is formed that includes a plurality of pixels performing photoelectric conversion; and a reinforcing member that is disposed on side of the light receiving section of the semiconductor substrate and includes an opening in which a part opposed to the light receiving section is opened. The present technology is applicable to, for example, an imaging device that captures an image, a camera module that focuses light to capture an image, an electronic apparatus equipped with a camera function, a vehicle control system that is mounted on a vehicle, an endoscopic surgery system that is used in an endoscopic surgery, and the like.