Solid-State Imaging Device Light-Shielding Resin Embedding

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Solution Overview

Problem

The existing methods for preventing flare or ghost occurrences in solid-state imaging devices due to light reflection in regions other than the light receiving portion are costly, often requiring processing with molds or print masks, which increases manufacturing costs and may not effectively reduce device height.

Innovation Solution

A solid-state imaging device with a glass plate and embedded light-shielding resin in the regions outside the light receiving portion, where grooves are formed and the resin is cured, allowing the glass plate to be bonded directly onto the imaging element without additional shielding members, reducing manufacturing costs and device height.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a plate member such as a flare preventing plate and a molded member is arranged in the region other than the light receiving portion, then the occurrence of flare or ghost can be prevented, but processing using a mold is required and cost increases

Engineering Contradiction:

Improveflare or ghost occurrenceVSAvoidmanufacturing cost

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The invention changes the material parameter from solid plate members to liquid resin, which can be injected into molds and cured in place. This allows the light-shielding function to be integrated directly into the sealing plate structure without requiring separate molded members, thereby reducing manufacturing cost while preventing flare and ghost

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention merges the light-shielding function with the sealing plate by embedding the light-shielding resin directly into the sealing plate's non-light-receiving regions. This integration eliminates the need for separate plate members and reduces the number of manufacturing steps, achieving cost reduction while maintaining flare prevention effectiveness

Inventive Principle:

Principle #5Merging (Combining)

2Object-affected harmful factors

Engineering Contradiction:

Improveflare or ghost occurrenceVSAvoiddevice height

Core Design Contradiction:

Object-affected harmful factorsVSLength of stationary object

Solution Approach 1:

The light-shielding resin is integrated directly into the sealing plate structure, eliminating the need for separate plate members that would increase device height. The resin is embedded within the sealing plate's thickness, maintaining a compact overall device profile while providing effective light shielding in non-light-receiving regions

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The light-shielding resin is applied only in specific non-light-receiving regions of the sealing plate rather than throughout the entire device. This localized application prevents flare and ghost where needed while minimizing the addition of material that would increase device height

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively prevents flare or ghost occurrences at a lower cost by embedding light-shielding resin in the non-receiving regions of the solid-state imaging device, reducing manufacturing expenses and allowing for easier adjustment of the resin's shape and size, while maintaining or reducing the device's height.

Implementation Method 1

a light-shielding resin is embedded in a region corresponding to a region other than a light receiving portion

Methodology Applied

Scientific EffectLight absorption: Absorption (EM radiation)

Implementation Method 2

a light-shielding resin is embedded into the groove and cured

Methodology Applied

Scientific EffectCuring: Photopolymerisation

Data Source

PatentUS10965895B2Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device

Publication Date: 2021.03.30 SONY GROUP CORP

AI summary

The present disclosure relates to a solid-state imaging device, a manufacturing method of a solid-state imaging device, and an electronic device capable of preventing occurrence of a flare or a ghost caused by reflection of light in a region other than a light receiving portion of a solid-state imaging element at low cost. The solid-state imaging device includes the solid-state imaging element and a sealing glass which is arranged on the solid-state imaging element and in which a light-shielding resin is embedded in a region corresponding to the region other than the light receiving portion of the solid-state imaging element. The present disclosure is applied to, for example, a solid-state imaging device in which a substrate on which the solid-state imaging element is die-bonded and wire-bonded is packaged, or the like.