Solid-state imaging device resin segmentation
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Solution Overview
Problem
Existing solid-state imaging devices for endoscopes are limited in size reduction due to excessive protrusion of sealing resin, hindering their miniaturization and operability in narrow spaces.
Innovation Solution
A solid-state imaging device design that minimizes size by using a transparent member, adhesive, and sealing resins strategically, with bump electrodes and connection terminals to maintain electrical connectivity while preventing resin protrusion, achieved through specific manufacturing processes and resin shapes that ensure the device's dimensions align with the imaging element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealing resin is used to seal the connection part between solid-state imaging element and lead, then reliability is improved, but device size increases due to excessive protrusion
Solution Approach 1:
The sealing resin is divided into two distinct parts: a first sealing resin that fills the connection part between the solid-state imaging element and lead, and a second sealing resin that seals the peripheral part of the transparent member. This segmentation allows each resin to perform its specific function without excessive protrusion, thereby maintaining reliability while reducing overall device size.
Solution Approach 2:
Different regions of the device receive different sealing treatments with appropriate resin types and amounts. The connection part receives targeted sealing with first sealing resin, while the periphery receives sealing with second sealing resin. This local differentiation ensures adequate sealing reliability in critical areas while minimizing resin protrusion in non-critical areas.
2Stability of the object's composition
If transparent member and adhesive are added to fix solid-state imaging element, then structural stability is improved, but device size increases
Solution Approach 1:
The transparent member serves multiple functions simultaneously: it acts as a protective cover, a structural support element, and an optical window for light transmission. The adhesive is integrated into the sealing structure rather than being a separate component. This merging of functions reduces the number of additional components needed, thereby maintaining structural stability while minimizing size increase.
3Ease of operation
If device size is reduced for narrow lumen insertion, then operability in narrow spaces is improved, but manufacturing precision requirements increase
Solution Approach 1:
The solid-state imaging element is positioned and fixed on the transparent member before the sealing resin is applied. The connection terminals are pre-aligned with the lead, and the bump electrodes are pre-positioned for electrical connection. This preliminary arrangement of components ensures proper alignment is achieved before final sealing, facilitating miniaturization while maintaining manufacturing feasibility.
Solution Approach 2:
The transparent member acts as an intermediary substrate that facilitates precise positioning of the solid-state imaging element and provides a stable platform for connection terminal alignment. The bump electrodes serve as intermediaries for electrical connection, enabling precise electrical coupling between the imaging element and lead without requiring direct contact alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the solid-state imaging device's size to match the dimensions of the imaging element, enhancing its operability in narrow spaces and improving reliability through symmetrical heat dissipation and electrical connectivity.
Implementation Method 1
a transparent member 1 is arranged on a light receiving surface 3a of the solid-state imaging element 3, and the transparent member 1 and the solid-state imaging element 3 are fixed by an adhesive 2
Implementation Method 2
a connection part between the solid-state imaging element 3 and a lead 112 is sealed by a first sealing resin 4, and a peripheral part of the transparent member 1 is sealed by a second sealing resin 5
Implementation Method 3
a lead 112 of a FPC (flexible printed circuit board) is connected to a bump electrode 110 formed on the light receiving surface
Data Source
Figure 1
Figure 2
Figure 3~3(f)
AI summary
To provide a solid-state imaging device including a solid-state imaging element and a substrate fixed to the solid-state imaging element by a sealing resin on a surface on an opposite side of a light receiving surface of the solid-state imaging element, in which an outer edge of the substrate seen from the light receiving surface side of the solid-state imaging element is positioned within an outer edge of the solid-state imaging element and an outer edge of the sealing resin seen from the light receiving surface side of the solid-state imaging element is positioned within the outer edge of the solid-state imaging element. Furthermore, to provide the solid-state imaging device in which the sealing resin is a first sealing resin and a second sealing resin not contacting the first sealing resin to seal the components is included.