Solid State Imaging Device Rib Support for Board Stiffness
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Solution Overview
Problem
Thinner camera module boards tend to flex and warp upon impact or pressure, leading to potential cracking and short circuits of the image sensor, which hinders the reduction of module thickness without compromising stiffness and optical performance.
Innovation Solution
A solid state imaging device with a frame part that includes ribs abutting the board next to the image sensor, providing additional support and stiffness, allowing for thinner board thickness while preventing flexure and cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the board is made thinner to reduce module height, then the module height is reduced, but the board becomes flexed and warped upon impact or pressure bonding, leading to image sensor cracking or warping
Solution Approach 1:
The invention adds a vertical dimension to the support structure by introducing a rib that extends from the frame part toward the board. This rib structure provides reinforcement in the thickness direction without increasing the overall module height, effectively resolving the contradiction between thinness and stiffness.
Solution Approach 2:
The rib is positioned specifically at the central area of the board where flexure occurs during ACF pressure bonding, providing localized reinforcement only where needed. This allows the board to remain thin overall while gaining sufficient stiffness at the critical location to prevent image sensor warping or cracking.
2Length of stationary object
If the board is made thinner to reduce module height, then the module height is reduced, but the board is more susceptible to flexure and warping, causing short circuit of connection parts
Solution Approach 1:
The rib structure extends in the vertical dimension to provide support without increasing module height, maintaining connection reliability while achieving height reduction.
Solution Approach 2:
The rib is pre-positioned to abut on the board at the central area before ACF pressure bonding occurs, providing preventive support against flexure that would otherwise cause connection short circuits during the bonding process.
3Device complexity
If the frame is joined to the board only at its outermost periphery, then the structure is simple, but the board becomes flexed in the central area upon drop impact or pressure bonding
Solution Approach 1:
The frame part is segmented to include a rib structure that divides the support function into two parts: the outermost periphery joining (maintaining simplicity) and the central area rib support (providing reinforcement). This segmentation resolves the contradiction between structural simplicity and support effectiveness.
Solution Approach 2:
The rib adds a vertical dimension to the frame structure, extending from the frame part toward the board to provide central area support without significantly increasing overall structural complexity or module height.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a camera module with reduced height and improved stiffness, preventing image sensor warping and associated short circuits, thus maintaining optical performance.
Implementation Method 1
the board becomes flexed in an area such as a central area upon drop impact or while an anisotropic conductive film (ACF) is being pressure-bonded thereto
Implementation Method 2
At least either of the abutting positions at which the support and the rib are to abut can be bonded to the board with adhesive
Data Source
AI summary
There is provided a solid state imaging device. A rib is arranged on a frame part to be joined to a board on which an image sensor is mounted, the rib abutting on the board at an abutting position next to a periphery of the image sensor.