Solid-state imaging device broken readout wiring correction
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Solution Overview
Problem
In solid state imaging devices, broken readout wirings lead to accumulation of charges in photodiodes, causing overflow and defective lines, especially in large-area photodetecting sections, which complicates data interpolation and reduces image resolution.
Innovation Solution
A solid state imaging device with a correction processing section that defines and corrects voltage values for neighboring pixel portions when a readout wiring is broken, using a relational expression or polynomial to adjust values based on incident light intensity dependencies, allowing for higher resolution images by avoiding reliance on normal line voltage values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If readout wirings are used to connect pixel portions to integration circuits, then charges can be read out from photodiodes, but broken readout wirings cause charge accumulation and overflow to neighboring pixels
Solution Approach 1:
The patent detects charge overflow to neighboring pixels (a harmful effect of broken readout wirings) and uses it as a diagnostic signal. By monitoring the voltage values in neighboring pixel portions, the system identifies the presence and location of broken wirings, converting the harmful charge accumulation into useful defect detection information that enables image correction.
2Reliability
If conventional interpolation methods are used to correct defective lines, then broken readout wiring defects can be addressed, but image resolution near defective lines deteriorates
Solution Approach 1:
The patent segments the correction process by treating each neighboring pixel portion independently. Instead of applying uniform interpolation across the entire defective line, the system individually evaluates voltage values in each neighboring pixel portion (Pm1,n2) and applies targeted corrections only where charge overflow occurs, preserving resolution in non-affected areas while correcting local defects.
Solution Approach 2:
The patent applies local quality correction by using voltage values from specific neighboring pixel portions adjacent to the broken wiring. Rather than relying on distant normal lines, the system uses locally adjacent pixels (Pm1,n2) whose voltage values are minimally affected by charge overflow, thereby maintaining high resolution in the corrected image while addressing the local defect.
3Ease of manufacture
If large-area photodetecting sections are integrated on semiconductor substrates, then single-wafer production is achieved, but readout wiring breakage probability increases
Solution Approach 1:
The patent implements a self-diagnostic system where the imaging device automatically detects broken readout wirings by monitoring voltage values in pixel portions. The system uses its own operational data (voltage readings from pixel portions Pm1,n2) to identify wiring defects without requiring external inspection equipment, enabling self-correction and maintaining reliability in large-area integrations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of high-resolution images even when readout wirings are broken, improving image quality by effectively correcting pixel data near defective lines without relying on normal line values.
Implementation Method 1
each including a photodiode which generates charges as much as incident light intensity
Data Source
AI summary
A solid state imaging device 1 includes a photodetecting section 10, a signal readout section 20, a controlling section 30, and a correction processing section 40. In the photodetecting section 10, M×N pixel portions each including a photodiode which generates charges as much as an incident light intensity and a readout switch connected to the photodiode are two-dimensionally arrayed in M rows and N columns. Charges generated in each pixel portion Pm,n are input into an integration circuit Sn through a readout wiring LO,n, and a voltage value output corresponding to the charge amount from the integration circuit Sn is output to an output wiring Lout through a holding circuit Hn. In the correction processing section 40, correction processing is performed for frame data repeatedly output from the signal readout section 20, and frame data after being subjected to the correction processing is output.