Imaging System Electronics Cooling Assembly Heat Dissipation
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Solution Overview
Problem
Conventional cold plates used for heat dissipation in electronics assemblies, such as those in imaging systems, are expensive, difficult to produce, and require frequent maintenance, limiting their effectiveness in managing heat generated by electronic components.
Innovation Solution
A cooling sub-assembly is integrated into the electronics assembly, featuring a heat transfer component with a base portion coupled to the circuit board and a heat dissipation portion extending through a heat transfer opening, which is in contact with a cooling fluid flowing through a cooling channel, effectively dissipating heat generated by the electronics component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cold plates with machined pipes are used for heat dissipation, then heat dissipation effectiveness is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The cooling system is divided into separate functional components: a cold plate with coolant flow paths and a separate heat dissipation assembly with fins. This segmentation allows each component to be manufactured independently using simpler processes, avoiding the need for complex machining of integrated pipe structures into the cold plate substrate.
Solution Approach 2:
The heat dissipation portion with fins is positioned to extend into the cooling channel defined by the circuit board assembly, creating a nested arrangement where the heat dissipation structure is embedded within the cooling fluid pathway. This nested configuration enables efficient heat transfer without requiring complex integrated pipe structures.
2Temperature
If conventional cold plates with machined pipes are used for heat dissipation, then heat dissipation effectiveness is improved, but production cost increases
Solution Approach 1:
By separating the cooling system into distinct components (cold plate with flow paths and separate heat dissipation assembly), each part can be manufactured using less expensive, simpler processes rather than requiring costly precision machining of integrated pipe structures into the substrate.
Solution Approach 2:
The heat dissipation assembly with fins can be manufactured as a simpler, more economical component that replaces the expensive machined cold plate design, reducing overall production costs while maintaining effective heat dissipation functionality.
3Temperature
If conventional cold plates are used for heat dissipation, then heat dissipation is achieved, but maintenance frequency increases
Solution Approach 1:
The segmented design with separate cold plate and heat dissipation assembly allows for easier inspection, cleaning, and maintenance of individual components. The modular structure enables targeted maintenance of the finned heat dissipation portion without requiring disassembly of complex integrated pipe structures.
Solution Approach 2:
The cooling system design with open cooling channels and externally accessible heat dissipation fins enables self-maintenance through easy cleaning and inspection, reducing the need for frequent professional maintenance services compared to sealed, complexly-machined cold plates.
4Temperature
If a heat dissipation portion extending through the circuit board is used, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The heat dissipation portion with fins is localized to extend only into the cooling channel region where cooling fluid flows, concentrating the heat dissipation function in the most effective location rather than distributing complexity throughout the entire device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the likelihood of damage to electronic components by efficiently dissipating heat, is easier and less expensive to manufacture than traditional cold plates, and maintains system performance without the need for frequent maintenance.
Implementation Method 1
The heat dissipation portion is configured to dissipate heat generated by the electronics component
Implementation Method 2
A cooling fluid is configured to flow through the cooling channel in contact with the heat dissipation portion of the heat transfer component. The heat dissipation portion of the heat transfer component and the cooling fluid are configured to dissipate heat generated by the electronics component
Data Source
AI summary
Among other things, an electronics assembly within an imaging system is provided. The electronics assembly includes a circuit board assembly through which a signal is delivered. The circuit board assembly defines a heat transfer opening between a first side and a second side. An electronics component is electrically coupled to the first side of the circuit board assembly. A heat transfer component supports the electronics component. The heat transfer component includes a base portion coupled to the electronics component and to the circuit board assembly. The heat transfer component includes a heat dissipation portion extending through the heat transfer opening of the circuit board assembly. The heat dissipation portion dissipates heat generated by the electronics component.