Imaging Element Heat Conduction Structure for Anti-Vibration Movement
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Solution Overview
Problem
Current imaging devices face challenges in efficiently dissipating driving heat generated by imaging elements, particularly during high-load imaging operations like video recording at 4K/120p, which can lead to thermal management issues and reduced operational duration.
Innovation Solution
The implementation of a heat conductive member system within the imaging element unit, comprising a graphite sheet-based first heat conductive member with a deformable structure, connected to metal-based second and third heat conductive members, which are sandwiched between outer and inner layers, allowing for effective heat dissipation while accommodating anti-vibration movements of the imaging element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a rigid heat dissipation structure is used, then heat dissipation efficiency is improved, but the structure cannot follow the movement of the imaging element during anti-vibration operation
Solution Approach 1:
The heat conductive member is designed with a multi-layer structure including bent portions that enable dynamic deformation. The outer layer portion and inner layer portion can relatively move and deform together when the imaging element moves during anti-vibration operation, allowing the heat dissipation structure to adapt to the imaging element's movement while maintaining thermal contact.
Solution Approach 2:
The heat conductive member uses a flexible multi-layer construction where the outer layer portion and inner layer portion can deform independently. This flexibility allows the structure to bend and follow the imaging element's movement without compromising the thermal conduction path, resolving the contradiction between rigidity for heat dissipation and flexibility for movement accommodation.
2Adaptability or versatility
If a deformable heat conductive member is used to follow imaging element movement, then adaptability is improved, but heat dissipation efficiency may be reduced
Solution Approach 1:
The heat conductive member employs a composite multi-layer structure where each layer can be made of different materials optimized for specific functions. The outer layer portion and inner layer portion are connected through bent portions, creating a composite structure that provides both deformability for movement accommodation and sufficient thermal conductivity for heat dissipation efficiency.
Solution Approach 2:
The inner layer portion is disposed within the space surrounded by the outer layer portion, creating a nested configuration. This nested structure allows both layers to deform and move together while maintaining close thermal contact, ensuring that the deformable structure does not compromise heat dissipation efficiency.
3Temperature
If multiple heat conductive members are layered, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The outer layer portion and inner layer portion are integrated into a single heat conductive member assembly that moves and deforms as a coordinated unit. This merging of multiple layers into one functional unit improves heat dissipation efficiency while avoiding the complexity of managing separate, independently-controlled heat dissipation components.
Solution Approach 2:
The multi-layer heat conductive member serves multiple functions simultaneously: it provides thermal conduction paths for heat dissipation, accommodates imaging element movement through deformation, and maintains structural integrity. This multi-functionality reduces the need for additional separate components, thereby reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation efficiency, enabling longer operational periods during high-load imaging tasks without hindering the anti-vibration functionality, and optimizes space usage within the device.
Implementation Method 1
a first heat conductive member to which driving heat of the imaging element is conducted from the back surface
Implementation Method 2
The first heat conductive member is formed of a graphite sheet
Data Source
AI summary
An imaging element unit that is built in a housing of an imaging device includes an imaging element that includes an imaging surface imaging a subject and a back surface opposite to the imaging surface, an anti-vibration function that moves the imaging element in plane directions of the imaging surface, and a first heat conductive member to which driving heat of the imaging element is conducted from the back surface and which is deformed to be capable of following movement of the imaging element caused by the anti-vibration function. The first heat conductive member includes an outer layer portion and at least one inner layer portion that is connected to the outer layer portion and is disposed in a space surrounded by the outer layer portion, and the outer layer portion and the inner layer portion include bent portions that allow the first heat conductive member to be deformable.