Imaging Element Projection Sealing Material Penetration
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Solution Overview
Problem
In flip-chip mounting of imaging elements, the penetration of solutes and solvents from sealing materials into the photoelectric conversion unit poses a problem, which can be mitigated by increasing the size of the imaging element and wiring substrate, but this is costly and undesirable.
Innovation Solution
A projection is provided on the side surface of the imaging element, allowing the sealing material to be attracted to the projection rather than penetrating into the gap, and the imaging element is flip-chip mounted on a wiring substrate with the projection facing outward to prevent solvent and solute penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sufficient distance is secured from the end of the imaging element to the photoelectric conversion unit, then penetration of sealing material components is avoided, but the size of the imaging element and wiring substrate increases
Solution Approach 1:
The invention transitions from protecting the photoelectric conversion unit by increasing linear distance in one dimension to using a three-dimensional protruding structure that extends from the side surface. This protrusion creates a spatial barrier in multiple dimensions, blocking the path of solute and solvent penetration without requiring increased overall device dimensions.
Solution Approach 2:
The protrusion acts as an intermediary structure between the sealing material and the photoelectric conversion unit. It provides a physical barrier that intercepts and blocks the harmful components (solute and solvent) before they can reach the sensitive photoelectric conversion elements, thereby protecting the unit without requiring additional space.
2Reliability
If the size of imaging element and wiring substrate is increased, then penetration of sealing material components is prevented, but manufacturing cost increases
Solution Approach 1:
Instead of increasing the overall footprint area of the imaging element, the invention utilizes the vertical dimension by creating a protrusion from the side surface. This approach provides effective protection against sealing material penetration while maintaining the original device dimensions, thereby avoiding increased manufacturing costs associated with larger substrates.
Solution Approach 2:
The protection mechanism is implemented locally at specific critical areas where sealing material penetration is most likely to occur, rather than uniformly increasing the size of the entire imaging element. This localized approach reduces material consumption and manufacturing costs while providing targeted protection where it is most needed.
3Ease of operation
If flip-chip mounting is performed with photoelectric conversion unit facing wiring substrate, then electrical connection is achieved, but sealing material can penetrate and cause damage
Solution Approach 1:
The protrusion serves as an intermediary protective structure that does not interfere with the electrical connection function between the imaging element and wiring substrate, while simultaneously blocking the harmful penetration path of sealing materials. It creates a physical barrier that redirects or stops solute and solvent before they can reach the photoelectric conversion unit.
Solution Approach 2:
The side surface of the imaging element is segmented into different functional regions, with the protrusion forming a distinct protective segment that specifically addresses the sealing material penetration issue while leaving other functional areas (such as electrical connection regions) unaffected and operational.
Data Source
AI summary
An imaging element according to the present disclosure is an imaging element flip-chip mounted on a wiring substrate, in which a projection is provided on a side surface of the imaging element such that a bottom surface side of the imaging element projects from a top surface side. Then, in the imaging device according to the present disclosure, the imaging device is flip-chip mounted on the wiring substrate so that a top surface of the imaging element faces the wiring substrate, and an outer periphery of the imaging element on the wiring substrate is sealed with a sealing material. An adhesion site of the sealing material is urged to a side of the projection, so that penetration of a solute and a solvent forming the sealing material may be reduced.