Imaging Device Flange Back Adjustment Mechanism
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Solution Overview
Problem
The existing imaging device configurations face restrictions in circuit board size and are prone to noise and radiation due to the flange back adjustment mechanism, which limits the accuracy of image sensor positioning orthogonal to the optical axis and requires additional circuit boards for the driving system.
Innovation Solution
An imaging device with a lens mount, an image sensor holder, biasing members, and an adjustment mechanism that includes a slider with inclined faces and protruding portions, allowing for precise flange back adjustment without restricting circuit board size, enabling high accuracy in image sensor positioning orthogonal to the optical axis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the flange back adjustment mechanism is disposed around the circuit boards with the adjustment ring around the CCD substrate, then the image sensor can be biased toward the lens mount, but the size of the circuit board is restricted and noise and radiation affect the device
Solution Approach 1:
The patent extracts the flange back adjustment mechanism from the CCD substrate area and relocates it to the lens mount side. The adjustment ring is now disposed around the lens mount rather than the CCD substrate, separating the adjustment function from the image sensor mounting area. This extraction eliminates the restriction on circuit board size and reduces noise and radiation interference while maintaining adjustment precision.
2Measurement precision
If the adjustment ring is disposed around the CCD substrate with circular protruding parts, then flange back adjustment can be performed, but the CCD substrate size must be smaller than the adjustment ring
Solution Approach 1:
The patent inverts the traditional arrangement by placing the adjustment ring around the lens mount instead of around the CCD substrate. The adjustment mechanism now operates on the lens mount side with protruding parts engaging with the adjustment ring, while the CCD substrate is mounted separately on the image sensor holder. This inversion allows the CCD substrate to be larger than the adjustment components without spatial conflict.
3Ease of operation
If clearance is set in the direction orthogonal to the optical axis to allow CCD mounting body movement, then flange back adjustment is possible, but the CCD mounting body deviates when force acts on it
Solution Approach 1:
The patent segments the adjustment mechanism into two independent parts: (1) the image sensor holder with CCD mounting body that maintains fixed positioning in the optical axis direction, and (2) the adjustment ring on the lens mount side that performs flange back adjustment. The adjustment ring engages with protruding parts on the image sensor holder through inclined surfaces, allowing adjustment without requiring clearance that would permit deviation of the CCD mounting body.
4Adaptability or versatility
If the image sensor holder is biased using compression coil spring, then flange back adjustment can be performed, but the adjustment mechanism restricts circuit board disposition
Solution Approach 1:
The patent introduces an intermediary structure - the image sensor holder with protruding parts that engage with the adjustment ring on the lens mount side. This intermediary mechanism transmits the biasing force from the compression coil spring while allowing the adjustment ring to operate independently on the lens mount. The circuit board is mounted on the image sensor holder away from the adjustment mechanism, eliminating disposition restrictions while maintaining adjustment functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for high-accuracy image sensor positioning orthogonal to the optical axis without circuit board size restrictions, minimizing noise and radiation influence by securing the CCD holder area and reducing the distance between the image sensor and electronic components.
Implementation Method 1
biasing members that bias the image sensor holder in a direction of the lens mount
Data Source
AI summary
There is provided an imaging device including a lens mount on which a lens is mounted, an image sensor that has an imaging face on which a subject image is formed by the lens, an image sensor holder on which the image sensor is mounted, biasing members that bias the image sensor holder in a direction of the lens mount, and an adjustment mechanism that is provided between the image sensor holder and the lens mount to adjust a distance between the imaging face and the lens mount.


