Solid-State Imaging Apparatus Frame Leg for Flare Suppression
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Solution Overview
Problem
The existing solid-state imaging apparatuses face challenges in reducing size while preventing flare, as light reflected off bonding wires can cause image distortion, and current configurations struggle to achieve both compactness and high image quality.
Innovation Solution
A solid-state imaging apparatus with a frame member that has a leg portion extending to cover the bonding wires, ensuring that light is blocked from reaching the imaging surface, and a manufacturing method that integrates this frame member with a light-transmissive optical member to prevent flare, allowing for further size reduction and improved image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the solid-state imaging apparatus is reduced, then compactness is improved, but flare increases due to light reflecting off bonding wires reaching the imaging surface
Solution Approach 1:
The patent extracts the harmful reflective property of bonding wires by covering them with a light-blocking coating. This removes the flare-causing characteristic while preserving the electrical connection function, allowing size reduction without flare penalties.
Solution Approach 2:
The patent introduces a light-blocking coating as an intermediary substance between the bonding wires and incident light. This coating layer blocks harmful light reflections while allowing the bonding wires to maintain their electrical function, resolving the contradiction between compactness and flare prevention.
2Ease of manufacture
If bonding wires are exposed without coverage, then manufacturing simplicity is maintained, but flare occurs that degrades image quality
Solution Approach 1:
The patent extracts the harmful reflective property of bonding wires by covering them with a light-blocking coating. This removes the flare-causing characteristic while preserving the electrical connection function, allowing size reduction without flare penalties.
Solution Approach 2:
The patent changes the optical parameter of the bonding wires by applying a light-blocking coating, transforming them from reflective surfaces to light-absorbing structures. This parameter change eliminates flare while maintaining electrical functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses flare and enables the reduction of the solid-state imaging apparatus size while maintaining high image quality by ensuring that light is blocked from the bonding wires, thus enhancing the compactness and functionality of digital cameras and other electronic systems.
Implementation Method 1
The optical member transmits light incident from above (subject image) and guides it to the solid-state imaging device
Implementation Method 2
The optical member includes lenses and an IR cutoff filter... transmit the subject image incident from above and focus it on the imaging surface
Implementation Method 3
the frame member has a leg portion extending from the side where the optical member is present toward the imaging surface... ensuring that light is blocked from reaching the imaging surface
Implementation Method 4
a bonding wire that electrically connects a pad formed on the solid-state imaging device to a lead island formed on the substrate
Implementation Method 5
the subject image having passed through the optical member and having been focused on the imaging surface is converted by the solid-state imaging device into an electric signal in a photoelectric conversion process
Data Source
AI summary
A solid-state imaging apparatus includes: a solid-state imaging device mounted on a substrate; a bonding wire that electrically connects a pad formed on the solid-state imaging device to a lead island formed on the substrate; a frame member that has a frame-like shape and surrounds side portions of the solid-state imaging device; and a light-transmissive optical member so accommodated in the frame member that the optical member faces an imaging surface of the solid-state imaging device, wherein the frame member has a leg portion extending from the side where the optical member is present toward the imaging surface, and the frame member is integrally fixed to the solid-state imaging device with an end of the bonding wire that is connected to the pad covered with the leg portion.