Imaging Device Frame Body Mounting for Compact Profile
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Solution Overview
Problem
Conventional imaging devices face challenges in further slimming down due to reduced mechanical strength and surface irregularities caused by thin recesses in wiring boards, leading to tilted imaging elements and improper electronic component mounting, which affects image signal quality and device size.
Innovation Solution
The design incorporates a circuit board with a frame body that surrounds electronic components, allowing the imaging element to be mounted on the upper surface, eliminating the need for a recess bottom and enabling a more compact, lower-profile device with improved mechanical strength and proper component alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the bottom thickness of the recess is reduced to slim down the imaging device, then the profile height is reduced, but the mechanical strength of the wiring board deteriorates and breakage occurs
Solution Approach 1:
The patent divides the wiring board into two separate components: the main wiring board and a recess bottom plate. The recess bottom plate is a separate component that is attached to the wiring board to form the bottom of the recess. This segmentation allows the recess bottom plate to provide mechanical strength and support, preventing breakage, while the overall device profile can be reduced by optimizing the thickness of individual components rather than being constrained by a single thick wiring board.
2Length of stationary object
If the bottom thickness of the recess is reduced, then the device size is reduced, but surface irregularities increase making the bottom non-flat
Solution Approach 1:
The recess bottom plate serves as an intermediary component between the wiring board and the imaging element. It provides a flat, stable mounting surface for the imaging element while being attached to the wiring board. The bottom plate compensates for surface irregularities and ensures proper flatness, allowing the recess to be shallow without compromising the flatness required for proper imaging element mounting.
3Length of stationary object
If the recess bottom thickness is reduced, then the imaging device becomes more compact, but the imaging element cannot be mounted properly
Solution Approach 1:
By separating the recess bottom into a distinct plate component, the patent enables proper mounting of the imaging element on this dedicated flat surface. The bottom plate provides adequate thickness and structural integrity specifically at the mounting location, ensuring the imaging element can be properly secured while allowing the overall recess depth to be minimized for a compact device design.
Data Source
AI summary
An imaging device includes a circuit board having a wiring line formed as part of an upper surface thereof; an electronic component mounted on the circuit board; a frame body mounted on the circuit board so as to surround the electronic component, and having connection electrodes formed on or above an upper surface thereof and external terminals formed on or above at least one of a side surface and a lower surface thereof which are electrically connected to the connection electrodes; an imaging element having a light-receiving section located in a central portion of an upper surface thereof, the imaging element being mounted on the upper surface of the frame body so as to cover an opening of the frame body; and a lens barrel having a lens, which is bonded to an outer periphery of the upper surface of the frame body so as to cover the imaging element.