Imaging Lens Module Structure for Miniaturized Sensor Mounting
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Solution Overview
Problem
Conventional optical systems face challenges in miniaturization due to structural thickness requirements for mechanical strength, making it difficult to achieve further miniaturization while ensuring structural integrity for mass production.
Innovation Solution
The imaging lens module incorporates a sensing part with a substrate and sensing chip, a lens assembly, a lens holding member with wire correspondence structures, an isolating article, and a plastic molding article, which provides structural support and fixes the lens holding member to the sensing part, ensuring mechanical strength and optical quality while allowing for miniaturization through a combination of heat dissipation, anti-reflection membranes, and insert molding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional optical systems use designated thicknesses of structural parts to maintain sufficient mechanical strength, then structural strength is improved, but device size increases and miniaturization becomes difficult
Solution Approach 1:
The patent integrates the lens holding member and support base into a single unified structure. The lens holding member directly contacts the substrate to provide support, eliminating the need for separate thick structural components. This merging of functions allows the system to maintain mechanical strength while reducing overall device volume and enabling miniaturization.
Solution Approach 2:
The lens holding member serves multiple functions simultaneously: it holds the lens assembly, provides structural support to the substrate, and acts as a mechanical anchor point. By making this single component multi-functional, the patent eliminates the need for additional dedicated support structures, thereby reducing device size while maintaining sufficient mechanical strength.
2Volume of moving object
If the lens holding member is positioned closer to the optical effective area to reduce device size, then miniaturization is improved, but structural strength may be compromised
Solution Approach 1:
The patent positions the lens holding member at a specific height above the substrate surface, creating a three-dimensional arrangement where the holding member extends vertically from the substrate. This dimensional arrangement allows the holding member to be close to the optical effective area horizontally while maintaining adequate structural support through its vertical positioning and direct contact with the substrate.
3Productivity
If a plastic molding article is used to fix the lens holding member to the sensing part, then manufacturing efficiency is improved, but complexity of assembly process increases
Solution Approach 1:
The lens holding member is pre-positioned on the substrate before the plastic molding article is formed. This preliminary positioning ensures correct alignment and integration, while the subsequent molding process automatically secures the holding member in place. This sequence of operations simplifies the overall assembly process by combining positioning and fixing steps into a single integrated manufacturing flow.
Data Source
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AI summary
An imaging lens module (1) includes a sensing part (11), a lens assembly (12), a lens holding member (13), an isolating article (14) and a plastic molding article (15). The sensing part (11) includes a substrate (111), a sensing chip (112) and a plurality of conducting wires (113). The substrate (111) supports the sensing chip (112). The sensing chip (112) includes an optical effect area (1121) and an electrical connection area (1122). The conducting wires (113) are electrically connected to the electrical connection area (1122) for transmitting an image signal. The lens assembly (12) corresponds to the optical effect area (1121). The lens holding member (13) holds the lens assembly (12). The lens holding member (13) includes a wire correspondence structure (131) corresponding to the conducting wires (113). The isolating article (14) is between the wire correspondence structure (131) and the conducting wires (113). The plastic molding article (15) is molded on the sensing part (11). The plastic molding article (15) physically contacts the lens holding member (13) to fix the lens holding member 913) with respect to the sensing part (11).