Imaging Device Light Emitter Heat Dissipation
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Solution Overview
Problem
Imaging devices using LEDs face a decrease in light output due to increased temperature from heat generation, which is not effectively addressed by existing heat dissipation methods.
Innovation Solution
An imaging device with a lens unit, imaging unit, light emitting elements installed in a plane perpendicular to the optical axis, and a control unit that selectively powers either a first light emitting element with a broader distribution or multiple second light emitting elements with narrower distributions, arranged diagonally or at equal intervals around the optical axis to optimize light distribution and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the amount of current is increased to increase the amount of irradiating light, then the light output is improved, but the temperature increases due to heat generation which results in a decrease in light amount
Solution Approach 1:
The patent divides the light emitting elements into multiple separate elements (first light emitting element and second light emitting elements) arranged at different positions around the optical axis. This segmentation allows each element to be controlled independently and distributed heat generation across multiple locations, preventing concentrated heat buildup while maintaining total light output.
Solution Approach 2:
The patent assigns different light distribution characteristics to different elements: the first light emitting element has a broader light distribution range while the second light emitting elements have narrower light distribution ranges. This local differentiation optimizes light distribution patterns and heat dissipation at specific locations, with elements at different radial distances from the optical axis contributing differently to both illumination and thermal management.
2Stability of the object's composition
If multiple light sources are used to improve light distribution, then the illumination uniformity is improved, but the device complexity increases
Solution Approach 1:
The patent makes the element installation plane serve multiple functions: it acts as both the mounting structure for the light emitting elements and as a heat dissipation structure. The plane is configured to transmit heat from the light emitting elements to its back surface, eliminating the need for separate heat sinks or cooling mechanisms and reducing overall device complexity while maintaining effective heat management.
Solution Approach 2:
The patent combines the structural support function and heat dissipation function into a single integrated element installation plane. This merging of functions reduces the number of separate components needed, simplifying the overall device structure while effectively managing heat from multiple light emitting elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures optimal light distribution and heat dissipation, maintaining light output while managing heat generation, thereby improving the performance of imaging devices.
Implementation Method 1
Known in the related art is an imaging device using an LED as lighting
Implementation Method 2
an imaging unit configured to convert light, with which an image is formed by the lens unit, into an image signal
Implementation Method 3
temperature is increased by heat generation of the LED itself
Data Source
AI summary
An imaging device includes, an element installation plane configured to install light emitting elements in a plane perpendicular to an optical axis. The element installation plane includes a first installation position relatively long in distance from an optical axis of a lens unit and a second installation position relatively short in distance therefrom. At least one of the light emitting elements is installed at the second installation position.