Imaging Metrology for Non-Destructive Substrate Thickness Prediction
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Solution Overview
Problem
Conventional methods for measuring substrate deposition processes are either destructive or rely on erroneous assumptions about uniformity across substrate regions, leading to non-uniformity and potential malfunction of substrates.
Innovation Solution
A method and system that utilize optical metrology data and known structure data from a reference region to determine the growth rate of that region, and then predict the thickness data of regions without known structure data, allowing for corrective actions to ensure uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional destructive measurement methods are used, then measurement accuracy is improved, but substrate loss and manufacturing cost increase
Solution Approach 1:
The patent replaces destructive mechanical measurement methods with non-destructive optical measurement methods. Optical metrology tools measure substrate thickness and uniformity through optical properties without physically contacting or damaging the substrate, thereby maintaining measurement accuracy while eliminating substrate loss.
Solution Approach 2:
The patent introduces optical metrology as an intermediary measurement technique that indirectly measures substrate thickness through optical properties rather than direct physical contact. This intermediary approach allows accurate measurement without the need for destructive sampling.
2Device complexity
If uniformity assumptions are made across substrate regions, then measurement complexity is reduced, but measurement precision deteriorates due to erroneous assumptions
Solution Approach 1:
The patent divides the substrate into multiple distinct regions (first region with known structure data and second region with unknown structure data) and applies different measurement and prediction approaches to each region. This segmentation allows accurate measurement of the first region while using growth rate modeling to predict the second region, avoiding erroneous uniformity assumptions.
Solution Approach 2:
The patent applies different measurement and analysis methods to different substrate regions based on their specific characteristics. The first region receives direct optical metrology measurement with known structure data, while the second region uses growth rate-based prediction, ensuring each region is measured with the most appropriate method for its specific properties.
3Manufacturing precision
If optical metrology is used for all substrate regions, then substrate uniformity is improved, but measurement time and processing complexity increase
Solution Approach 1:
The patent performs preliminary optical metrology measurements on the first region to establish known structure data and growth rates before processing the second region. This preliminary action creates a reference baseline that can be used to predict the second region's characteristics, reducing the need for time-consuming direct measurements across the entire substrate.
Solution Approach 2:
The patent creates a predictive model of the second region based on the measured characteristics and growth rates of the first region. This copying approach uses the first region as a template to infer the second region's properties, significantly reducing measurement time while maintaining accuracy through the established growth rate relationships.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables non-destructive, accurate thickness data prediction for substrates, reducing errors and improving substrate uniformity, leading to better manufacturing outcomes and reduced substrate discard.
Implementation Method 1
receiving optical metrology data of the substrate associated with one or more substrate deposition processes in a processing chamber
Data Source
AI summary
A method includes identifying a first growth rate of a first region of a substrate associated with one or more substrate deposition processes performed in a processing chamber of substrate processing equipment. The method further includes determining, based on the first growth rate, thickness data of a second region of the substrate without second structure data of the second region. The thickness data is determined in a non-destructive manner. The method further includes causing performance of an action associated with processing one or more substrates via the processing chamber of the substrate processing equipment based on the thickness data of the second region of the substrate.