Imaging Module Housing Structure for Compact Heat Dissipation
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Solution Overview
Problem
Conventional imaging devices face challenges in being compact due to larger outer dimensions and suffer from heat dissipation issues, as higher performance leads to increased energy consumption and heat generation, making it difficult to implement effective cooling methods without compromising device size or heat dissipation performance.
Innovation Solution
The imaging device features a board section with a first and second housing section that sandwich the board, using attachment members to fix the board, allowing for compact size while improving heat dissipation through metal components with excellent heat dissipation properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the board section is fixed inside a housing of the imaging device, then the imaging device can be made compact, but the heat dissipation performance deteriorates
Solution Approach 1:
The patent merges the housing structure with heat dissipation functionality by making the first and second housing sections themselves serve as heat dissipation paths. The housing sections are configured to contact the board section, creating a integrated structure that provides both mechanical support and thermal management without requiring separate cooling components.
Solution Approach 2:
The housing sections perform multiple functions: they mechanically fix the board section and simultaneously serve as heat dissipation paths. This multi-functionality eliminates the need for dedicated heat dissipation components, achieving both compact size and effective thermal management.
2Temperature
If forced cooling such as heat dissipation fan is used, then heat dissipation performance is improved, but device size increases
Solution Approach 1:
The patent extracts the heat dissipation function from separate cooling components (like fans or heat sinks) and integrates it directly into the housing structure. This eliminates the need for additional cooling components, maintaining compact device size while achieving effective heat dissipation through the housing sections.
3Temperature
If heat transfer plate is used for heat dissipation, then heat dissipation performance is improved, but device size increases
Solution Approach 1:
Instead of adding a separate heat transfer plate, the patent merges the heat dissipation function into the existing housing sections. The first and second housing sections are configured to contact the board section and serve as heat dissipation paths, eliminating the need for additional heat transfer components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows the imaging device to be made small while maintaining effective heat dissipation, as the board is fixed between housing sections with excellent heat dissipation properties, reducing the need for additional cooling components and maintaining performance.
Implementation Method 1
it is effective to perform heat dissipation using heat conduction via a heat transfer plate or the like
Data Source
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AI summary
Provided is an imaging device 10, that can be made compact. Imaging device 10 includes board section 12 on which imaging element is loaded, first housing section 13 for fixing board section 12 from a surface on which imaging element 17 is loaded; second housing section 14 for fixing board section 12 from a surface opposite to the surface on which imaging element 17 is loaded; and lens section 15 attached to the first housing section 13 side; first housing section 13 and second housing section 14 are fixed by attachment members 25 so as to sandwich board section 12. First housing section 13 may be configured from board fixing member 21 for fixing board section 12, and lens attachment member 22 for attaching lens section 15 that is fixed to board fixing member 21 in a positionally adjustable manner.