Imaging Module Heat Transfer via Stacked PCB Orientation
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Solution Overview
Problem
Imaging modules with multiple high power devices face significant heat accumulation, leading to reduced performance and increased risk of failure due to inefficient heat dissipation within the module assembly.
Innovation Solution
The implementation of a heat transfer system where the image sensor, memory device, and imaging circuit are oriented in opposing configurations on printed circuit boards, with integrated heat sinks that allow heat to be dispersed outside the housing, rather than concentrating it within the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple high power devices are integrated within the imaging module, then the functionality and processing capability of the module is improved, but heat accumulation increases leading to reduced performance and reliability
Solution Approach 1:
The patent transitions from a planar arrangement of devices to a three-dimensional stacked configuration. Multiple high-power devices are vertically stacked one above another within the same housing, allowing the module to maintain compact footprint while distributing thermal volume across multiple dimensions. This spatial reconfiguration enables better heat distribution without increasing the module's overall footprint.
Solution Approach 2:
The imaging module is divided into distinct functional layers with each high-power device isolated in its own vertical position. The stacked architecture segments the thermal load across multiple discrete locations rather than concentrating heat in a single plane, allowing independent thermal management for each device while maintaining overall system functionality.
2Temperature
If heat dissipation is improved by extending heat sinks outside the housing, then heat concentration within the module is reduced, but the overall size of the module increases
Solution Approach 1:
The heat sink structures are nested within or integrated with the existing housing architecture rather than extending outward as separate components. The thermal management features are embedded in the module design, utilizing available space efficiently to dissipate heat without adding significant external dimensions to the module.
Solution Approach 2:
Heat dissipation features are strategically positioned at specific locations within the housing where thermal conduction paths are most effective. Localized heat sinks and thermal pathways are implemented only where needed, rather than uniformly distributing thermal management across the entire module, thereby minimizing overall size while maintaining effective heat dissipation.
3Area of stationary object
If devices are arranged in a stacked configuration to reduce footprint, then space efficiency is improved, but heat transfer efficiency deteriorates causing heat concentration within the housing
Solution Approach 1:
Thermal interface materials and conductive pathways serve as intermediaries between the stacked devices and the housing. These thermal management layers facilitate efficient heat transfer from the closely spaced devices to the housing structure, enabling the stacked configuration to maintain both compact footprint and effective heat dissipation.
Solution Approach 2:
The patent modifies thermal conduction parameters by implementing enhanced thermal pathways and heat sink structures that optimize heat flow from the stacked devices. Thermal interface properties and conduction characteristics are engineered to compensate for the close proximity of devices in the stacked arrangement, maintaining effective heat transfer despite the space-efficient configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces heat concentration within the imaging module, enhancing performance and reducing the likelihood of heat-induced failures by facilitating efficient heat transfer through the use of embedded and external heat sinks.
Implementation Method 1
heat is transferred outside of the space and not concentrated within the imaging device assembly
Data Source
AI summary
An imaging device provides efficient heat transfer by orienting components of the imaging device such that heat is transferred out of the imaging device instead of within the imaging device assembly. Heat is transferred out of the imaging device assembly through a printed circuit board to which the assembly housing is mounted thereon and/or through the housing itself.