Imaging Module Resin Encapsulation for Stronger Solder Joints
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Solution Overview
Problem
Conventional small solid-state imaging devices for electronic endoscopes face issues with insufficient joint strength and electrical insulation due to solder connections between substrates and components, leading to peeling and exposure of solder, which affects reliability and size constraints.
Innovation Solution
An imaging module design that incorporates a resin mold to coat electrode surfaces, cable terminals, and signal cables, enhancing electrical insulation and joint strength between image-sensing device electrodes and wirings, while reducing the module's diameter by positioning the substrate, resin mold, and signal cable within the image-sensing device's outline.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is used to connect bonding pads of substrates and components, then electrical connection is achieved, but joint strength is insufficient and peeling occurs
Solution Approach 1:
The patent applies composite materials by combining solder with resin mold material to create a hybrid connection structure. The resin mold coats the solder joints and bonding pads, forming a composite structure that provides both electrical connection (through solder) and mechanical strength (through resin encapsulation), preventing peeling while maintaining electrical conductivity.
Solution Approach 2:
The resin mold acts as an intermediary material that bridges the solder joints and bonding pads. It encapsulates the solder connections and provides additional mechanical support and protection, serving as a mediator that enhances joint strength without interfering with the electrical connection function of the solder.
2Reliability
If solder is exposed for electrical connection, then electrical conductivity is achieved, but electrical insulation is compromised
Solution Approach 1:
The resin mold provides localized insulation coverage over the solder joints and bonding pads. The structure maintains local electrical conductivity where needed (at the bonding interfaces) while providing insulating protection in surrounding areas, creating different electrical properties in different locations of the same structure.
Solution Approach 2:
The resin mold forms a flexible insulating coating or shell that encapsulates the exposed solder and bonding pads. This thin film structure provides electrical insulation while allowing the underlying electrical connections to function, protecting against short circuits and environmental factors.
3Reliability
If substrate and signal cable are positioned outside image-sensing device outline, then assembly is simplified, but module diameter increases
Solution Approach 1:
The substrate and signal cable are positioned and arranged within the outline of the image-sensing device, creating a nested configuration. The resin mold encapsulates all components including the substrate and cable, nesting them within the overall device boundary, thereby reducing the module diameter while maintaining functional integration.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by positioning the substrate and signal cable in different layers and orientations within the device outline. The resin mold encapsulates components in three dimensions, allowing efficient space utilization that reduces the overall diameter compared to two-dimensional flat layouts.
Data Source
AI summary
An imaging module of the invention includes an image-sensing device that has a light-receiving face, a substrate, a signal cable including a conductor, and a resin mold. A wiring of the substrate includes an electrode terminal and a cable terminal. The image-sensing device electrode is electrically connected to the electrode terminal via solder. The conductor is electrically connected to the cable terminal via solder. The resin mold coats the electrode surface, the cable terminal, the conductor, and the solder. On a plane of projection of the image-sensing device when viewed in a direction from the image-sensing device to the signal cable, the substrate, the resin mold, and the signal cable are disposed inside an outline of the image-sensing device.