Imaging Module Shield Plate Layout for Heat and EMI Control
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Solution Overview
Problem
Electronic devices, particularly onboard cameras, face challenges in downsizing while managing increased radiation noise and heat generation due to multilayered and highly-integrated circuit boards, necessitating improved heat dissipation and shielding solutions.
Innovation Solution
The electronic device incorporates a first and second metal plate with shield portions covering the side surfaces of substrates, along with a heat dissipation sheet, to enhance thermal conductivity and shield against radiation noise, using fixation points to secure the metal plates to a lens barrel, thereby improving heat dissipation and shielding properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit board is multilayered and highly-integrated to downsize the electronic device, then the device size is reduced, but radiation noise and heat generation are increased
Solution Approach 1:
The shield member is divided into a first shield member covering the first substrate and a second shield member covering the second substrate, allowing each substrate to be shielded independently while maintaining compact device dimensions
Solution Approach 2:
A heat conduction member made of soft material is introduced between the circuit board and the metal plate to conduct heat away from the highly-integrated circuit board while allowing the metal plate to serve as a radiation shield
2Object-affected harmful factors
If the entirety of the side surface of the circuit board is covered by a shield member, then radiation noise shielding is improved, but device complexity increases
Solution Approach 1:
The shield is segmented into separate first and second shield members that can be independently manufactured and assembled, reducing the complexity of manufacturing and assembly compared to a single comprehensive shield
Solution Approach 2:
The metal plate serves multiple functions: it provides structural support, acts as a radiation shield, and works with the heat conduction member to dissipate heat, thereby reducing the need for separate dedicated components
3Temperature
If a heat conduction member made of soft material is used between the circuit board and metal plate, then heat dissipation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The heat conduction member is made of soft material with specific physical parameters (softness, thermal conductivity) that allow it to conform to the circuit board surface, ensuring good thermal contact without requiring high manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration achieves enhanced heat dissipation and radiation noise shielding with a simple structure, improving thermal conduction and reducing manufacturing complexity and costs.
Implementation Method 1
the circuit board and a heat conduction member abut each other via a heat conduction member made of a soft material such as silicone gel
Implementation Method 2
the entirety of the side surface of a circuit board is covered by a shield member
Data Source
AI summary
An electronic device comprises a first substrate on which an imaging element is mounted; an optical system forming a subject image on a light receiving surface of the imaging element; a lens barrel housing the optical system; and a metal plate covering at least a part of a side surface of the first substrate and having a fixation portion fixed to the lens barrel. Also, an electronic device comprises a first substrate on which an imaging element is mounted; an optical system forming a subject image on a light receiving surface of the imaging element; a lens barrel housing the optical system; and a second metal plate having a shield portion covering at least a part of a side surface of the first substrate and a fixation portion fixed to the lens barrel.