Imaging Module External Terminal Placement for Distal Diameter Reduction
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Solution Overview
Problem
Existing endoscope imaging modules face challenges in minimizing the diameter of the distal portion due to the need for space to accommodate both the imaging element and external terminals, which limits the reduction of the insertion tool's size.
Innovation Solution
The imaging module design includes external terminals on the front surface with corresponding connecting electrodes on the back surface of the imaging element, eliminating the need for additional space by using through-hole electrodes and conductive films to connect these terminals directly to the substrate, allowing for a more compact configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If external terminals are arranged on the front surface of the imaging element, then external connections can be established, but the diameter of the distal portion increases due to the reserved area for holding member arrangement
Solution Approach 1:
The patent moves the connecting electrodes from the front surface (2D plane) to the back surface of the imaging element, utilizing the third dimension (depth/thickness) to resolve the space conflict. This allows external terminals to remain on the front surface for connections while eliminating the need for reserved areas on the front surface, thereby reducing the distal portion diameter.
Solution Approach 2:
Instead of placing connecting electrodes on the front surface where external terminals are located, the patent inverts the arrangement by placing them on the back surface of the imaging element. This inversion eliminates the spatial conflict between external terminals and holding members, allowing for a more compact distal portion design.
2Strength
If a holding member for the objective optical system is arranged on the front surface, then the optical system can be supported, but the substrate size increases due to the reserved area
Solution Approach 1:
The patent relocates the connecting electrodes to the back surface of the imaging element, utilizing the vertical dimension to separate the functions of external connection (front surface) and electrical connection (back surface). This eliminates the need for reserved areas on the front surface for holding member arrangement, thereby reducing substrate area while maintaining optical system support.
3Object-affected harmful factors
If the distal portion is made shorter and thinner to reduce patient pain, then patient comfort improves, but space for accommodating imaging elements and external terminals becomes insufficient
Solution Approach 1:
By moving connecting electrodes to the back surface of the imaging element, the patent effectively utilizes the third dimension (thickness) to accommodate all necessary components within a smaller overall volume. This enables the distal portion to be made shorter and thinner, directly addressing patient comfort requirements while maintaining all necessary functional spaces.
Solution Approach 2:
The patent arranges components in a nested configuration where the back surface connecting electrodes are positioned within the thickness of the imaging element assembly, allowing external terminals on the front surface and holding members to be arranged without increasing the overall diameter, thus enabling a more compact distal portion.
Data Source
AI summary
An imaging module includes an imaging element provided with an external terminal that is disposed at an end of the front surface on which a light-receiving surface is formed and also includes a substrate on which the imaging element is mounted. On the back surface of the imaging element, an external connecting electrode that is electrically connected to the external terminal is disposed. On the main surface of the substrate, an imaging element connecting electrode is disposed at a position opposing the external connecting electrode. The external connecting electrode is connected to the imaging element connecting electrode.