Imaging Module Terminals with Varying Exposed Areas for Precision Alignment
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Solution Overview
Problem
The challenge is to accurately position high-pixel imaging elements in imaging modules with a high pixel pitch, requiring precise alignment of lens and imaging element units while maintaining low manufacturing costs, as existing methods are costly and complex due to the need for high accuracy in terminal and probe pin positioning.
Innovation Solution
The imaging module design includes a lens unit with multiple driving units and connection portions with varying exposed surface areas to facilitate accurate positioning without increasing manufacturing costs, using a housing that accommodates these units and allows for easy alignment and bonding with the imaging element unit, which includes a flexible substrate and terminals for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If high pixel number imaging elements are used, then image quality is improved, but positioning accuracy requirements increase
Solution Approach 1:
The patent applies preliminary action by pre-positioning the probe pin and terminal structures before the actual bonding process. The probe pin is configured to automatically align with the terminal through predetermined positioning structures, allowing positioning to be performed before final assembly, thereby reducing the complexity of high-precision positioning during manufacturing.
Solution Approach 2:
The patent introduces an intermediary positioning structure that mediates between the imaging element unit and lens unit. This intermediary structure provides a reference framework that facilitates accurate positioning without requiring direct high-precision alignment between all components, thus reducing manufacturing complexity while maintaining positioning accuracy for high-pixel imaging elements.
2Reliability
If terminal and probe pin positioning is performed with high accuracy, then electrical connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies parameter changes by modifying the geometric parameters of the terminal and probe pin structures. Specifically, the terminal is designed with an exposed surface having a larger area than conventional designs, and the probe pin is configured with corresponding dimensional parameters that enable easier positioning. These parameter changes allow for reliable electrical connection without requiring expensive high-precision positioning equipment, thereby reducing manufacturing cost while maintaining connection reliability.
3Volume of moving object
If lens unit size is decreased, then module compactness is improved, but terminal positioning accuracy requirements increase
Solution Approach 1:
The patent applies local quality by providing different structural characteristics to different parts of the lens unit. Specifically, while the overall lens unit size is decreased for compactness, the terminal structure is designed with a larger exposed surface area and the probe pin is configured with appropriate dimensions. This local differentiation allows the terminal positioning to be performed with lower precision requirements despite the compact overall size, thus reducing manufacturing precision requirements while maintaining module compactness.
Data Source
AI summary
An imaging module 100 includes a lens unit 10 and an imaging element unit 20. The lens unit 10 includes a VCM 16A which moves a lens group 12 in a z direction, terminals 14A and 14B which are electrically connected to the VCM 16A, a VCM 16C and a VCM 16E which move the lens group 12 in an x direction and a y direction, and terminals 14C to 14F which are electrically connected to the VCM 16C and the VCM 16E. The imaging element unit 20 includes terminals 24A to 24F which are electrically connected to the terminals 14A to 14F. Exposed areas of the terminals 14A and 14B are larger than exposed areas of the terminals 14C to 14F.