Imaging Module Thermal Isolation for Compact Vehicle Cameras
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Solution Overview
Problem
Existing imaging devices in vehicles face challenges in miniaturization due to insufficient cooling performance, particularly when exposed to external heat, necessitating larger cooling units.
Innovation Solution
The imaging device incorporates a casing with separate heat dissipation units for the image sensor and main circuit board, utilizing heat isolation units with lower conductivity materials to prevent heat transfer between these units, and employs elastomer heat transmission members to guide heat dissipation through distinct pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the surface area of the cooling unit is increased to improve heat dissipation performance, then the cooling performance is improved, but the device size increases and miniaturization becomes difficult
Solution Approach 1:
The patent divides the heat dissipation system into separate independent units: an image sensor circuit board heat dissipation unit and a main circuit board heat dissipation unit. Each unit has its own dedicated heat dissipation path with heat dissipation fins, allowing efficient heat dissipation without requiring a large integrated cooling structure. This segmentation enables effective thermal management while maintaining compact device dimensions.
2Reliability
If the imaging device is exposed to external heat in vehicle mounting environments, then heat dissipation performance becomes insufficient, but increasing the cooling unit surface area prevents miniaturization
Solution Approach 1:
The patent introduces a heat isolation unit positioned between the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit. This heat isolation unit acts as a thermal barrier to prevent heat from one circuit board from affecting the other, thereby improving heat dissipation performance in high-temperature environments without requiring an oversized cooling system. The heat isolation unit enables compact design while maintaining reliability under external heat conditions.
3Temperature
If heat transmission between circuit boards is not isolated, then heat accumulation occurs affecting temperature control, but adding isolation structures increases device complexity
Solution Approach 1:
The patent applies heat isolation specifically at the critical interface between the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit, rather than implementing isolation throughout the entire device. The heat isolation unit is strategically positioned where heat transmission would most affect temperature control. This localized approach effectively prevents heat accumulation and maintains temperature control without unnecessarily increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively manages heat dissipation, allowing the imaging device to maintain component temperatures within allowable limits, facilitating miniaturization while reducing external heat influence.
Implementation Method 1
an image sensor heat transmission member configured to transmit heat from the image sensor circuit board to the image sensor circuit board heat dissipation unit
Implementation Method 2
a main circuit board heat transmission member configured to transmit heat from the main circuit board to a main circuit board heat dissipation unit exposed to the outside of the casing
Implementation Method 3
a heat isolation unit disposed between the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit to restrain heat transmission between the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit. The heat isolation unit is formed of a material with lower heat conductivity than materials of the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit
Implementation Method 4
an image sensor circuit board heat dissipation unit provided on an opposite side to the light reception surface side of the image sensor and exposed to outside of the casing
Implementation Method 5
an image sensor circuit board heat dissipation unit provided on an opposite side to the light reception surface side of the image sensor and exposed to outside of the casing
Data Source
AI summary
An imaging device includes: a casing; an image sensor circuit board housed in the casing and configured such that an image sensor is mounted; a lens unit provided on a light reception surface side of the image sensor and connected to the image sensor circuit board so that the image sensor is housed; an image sensor circuit board heat dissipation unit provided on an opposite side to the light reception surface side of the image sensor circuit board and exposed to outside of the casing; an image sensor heat transmission member configured to transmit heat from the image sensor circuit board to the image sensor circuit board heat dissipation unit; a main circuit board housed in the casing and configured such that an electronic component is mounted; a main circuit board heat transmission member configured to transmit heat from the main circuit board to a main circuit board heat dissipation unit exposed to the outside of the casing; and a heat isolation unit disposed between the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit to restrain heat transmission between the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit. The heat isolation unit is formed of a material with lower heat conductivity than materials of the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit.