Imaging Element Mounting Board Thermal Warping Control
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Solution Overview
Problem
Conventional imaging element mounting boards face challenges in reducing size while minimizing thermal distortion and warping, especially when exposed to varying temperatures, which can lead to image distortion due to differences in thermal expansion coefficients between the imaging element and the mounting board materials.
Innovation Solution
The development of an imaging element mounting board with a wire region having an equivalent elastic modulus of 5 GPa or more and 55 GPa or less, featuring a metal wire with a thickness of 1 μm or more and 8 μm or less, and a total thickness of 40 μm or less, which includes a metal shield layer for electromagnetic shielding and a conductive pattern with a ground wire, allowing for reduced size and improved reliability without the need for additional grounding layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a thin flexible-type wiring circuit board (FPC) is used to reduce size, then the board thickness is reduced, but thermal distortion and warping occur due to repeated high and low temperature exposure
Solution Approach 1:
The patent applies parameter changes by precisely controlling the equivalent elastic modulus of the wire region to be within 5-55 GPa. This specific parameter range allows the FPC to maintain flexibility and thinness while providing sufficient thermal stability to prevent warping under temperature variations, thus resolving the contradiction between reduced thickness and improved reliability
Solution Approach 2:
The patent uses composite materials by combining the FPC with a metal plate having a thermal expansion coefficient of 5-20 ppm/K. This composite structure leverages the low thermal expansion coefficient of the metal plate to counteract thermal distortion, allowing the thin FPC to maintain dimensional stability and prevent warping while keeping the overall board thickness reduced
2Reliability
If a thick rigid-type wiring circuit board with metal plate reinforcement is used, then warping is suppressed, but the board size increases
Solution Approach 1:
The patent applies local quality by reinforcing only the wire region (where metal wires and circuits are located) rather than the entire board. The equivalent elastic modulus is specifically controlled in the wire region to provide localized stiffness and thermal stability, preventing warping at critical areas while keeping the overall board thin and flexible in non-critical areas
Solution Approach 2:
The patent changes the parameter of equivalent elastic modulus in the wire region to a specific range (5-55 GPa) that provides optimal balance between flexibility and thermal stability. This parameter optimization allows the board to suppress warping without requiring thick rigid construction throughout the entire board, thus reducing overall size while maintaining reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces thermal distortion and warping, enabling a smaller form factor for imaging devices while maintaining excellent electrical properties and shielding capabilities, thus enhancing the reliability and efficiency of imaging devices.
Implementation Method 1
a metal shield layer for electromagnetic shielding
Implementation Method 2
when an imaging unit including the imaging element and the imaging element mounting board is placed under the external environment where a high temperature and a low temperature are repeated, thermal distortion may be generated
Data Source
AI summary
An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.