Solid-State Imaging Package Seal Glass Levelness

Solution Overview

Problem

Existing solid-state imaging devices face challenges in maintaining the levelness of seal glass mounted on a resin material before it is cured, which affects the compactness and yield of the device.

Innovation Solution

The use of optically-transparent members supported by multiple positions on the semiconductor package support, rather than relying solely on a sealing member, allows for the retention of levelness even before the sealing material is cured, and sealing all terminals and wires with a resin to reduce moisture permeation and corrosion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If seal glass is mounted on the upper surface of the semiconductor package support, then the solid-state imaging device can be made compact, but it is difficult to retain the levelness of the seal glass when the sealing material is not cured

Engineering Contradiction:

Improvedevice sizeVSAvoidlevelness of seal glass

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by forming support members on the semiconductor package support before mounting the seal glass. These support members are prepared in advance to provide stable positioning during the curing process, preventing position displacement and ensuring levelness is maintained even before the sealing material fully cures.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces support members as intermediary elements between the semiconductor package support and the seal glass. These support members act as mediators that provide stable positioning and support the seal glass during the curing process, ensuring levelness is maintained without requiring the sealing material to be fully cured before mounting.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If bonding wires are sealed with a resin material before curing, then the device can be made compact, but the resin material may cause position displacement of the seal glass

Engineering Contradiction:

Improvedevice sizeVSAvoidposition stability of seal glass

Core Design Contradiction:

Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The patent applies preliminary action by forming support members on the semiconductor package support before mounting the seal glass. These support members are prepared in advance to provide stable positioning during the curing process, preventing position displacement and ensuring levelness is maintained even before the sealing material fully cures.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces support members as intermediary elements between the semiconductor package support and the seal glass. These support members act as mediators that provide stable positioning and support the seal glass during the curing process, ensuring levelness is maintained without requiring the sealing material to be fully cured before mounting.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If a step is formed on the semiconductor package support to mount seal glass, then the seal glass can be supported, but the device size increases by the region outside the step

Engineering Contradiction:

Improvesupport for seal glassVSAvoiddevice size

Core Design Contradiction:

Manufacturing precisionVSVolume of moving object

Solution Approach 1:

The patent transitions from a two-dimensional planar support structure (step) to a three-dimensional distributed support structure (multiple support members at different positions). This dimensional change allows the seal glass to be supported stably without requiring a large step structure, thereby reducing the overall device size while maintaining support effectiveness.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent segments the support function into multiple discrete support members distributed at three or more positions on the semiconductor package support, rather than using a single continuous step structure. This segmentation provides stable support for the seal glass while minimizing the area occupied, thus reducing device size.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of compact solid-state imaging devices with improved levelness and product quality by supporting the optically-transparent member during the curing process and sealing all terminals and wires, reducing the risk of corrosion and position displacement.

Implementation Method 1

wherein the optically-transparent member is disposed on the between three or more support members coated with the thermosetting epoxy resin, and the thermosetting epoxy resin is cured

Methodology Applied

Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 2

coating surfaces of between 3-4 support members with a thermosetting epoxy resin; disposing a seal glass above the CCD solid-state image sensor on the between 3-4 support members coated with the thermosetting epoxy resin; and curing the thermosetting epoxy resin

Methodology Applied

Scientific EffectThermal curing: Heating

Data Source

PatentUS8952412B2Method for fabricating a solid-state imaging package

Publication Date: 2015.02.10 SONY GROUP CORP

AI summary

A method for manufacturing a solid-state imaging device. A solid-state image sensor is mounted on the semiconductor package support and electrically connected to first terminals and second terminals by bonding wires. The second terminals to which the bonding wires are connected are sealed with a sealing member. The optically-transparent member is thereafter disposed on the support member and the sealing member. The sealing member is cured to fix the optically transparent member.