Imaging Device Package Wire Bonding Area Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing imaging device package structure faces challenges in reducing size and improving the reliability of the wire connecting section due to the need for a large substrate peripheral edge and vulnerability to moisture intrusion, which leads to corrosion and reliability issues.
Innovation Solution
The imaging device package integrates a supporting body bonded to the substrate using a wire bonding area, sealing the wire and its terminal with a bonding section, eliminating the need for a separate bonding area and preventing moisture intrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate bonding area for the supporting body is provided on the outer side of the wire bonding area, then the supporting body can be securely bonded to the substrate, but the substrate peripheral edge area must be large, making it difficult to reduce package size
Solution Approach 1:
The patent merges the wire bonding area and the supporting body bonding area into a single integrated bonding region. The adhesive layer serves dual purposes: it bonds the wire to the substrate and simultaneously bonds the supporting body to the substrate. This eliminates the need for a separate bonding area on the outer side of the wire bonding area, thereby reducing the substrate peripheral edge area while maintaining bonding reliability.
2Ease of manufacture
If the wire bonding area is used as a separate area from the supporting body bonding area, then the wire can be bonded to the substrate, but the wire remains uncovered and vulnerable to moisture intrusion, leading to corrosion and reliability deterioration
Solution Approach 1:
The patent combines the wire bonding function and the protective sealing function into a single adhesive layer. The adhesive not only bonds the wire to the substrate but also covers and seals the wire and bonding terminal, protecting them from moisture intrusion. This dual-function approach eliminates the need for separate protective structures while improving wire connecting section reliability.
3Ease of manufacture
If a large substrate peripheral edge area is secured for separate bonding areas, then the wire bonding and supporting body bonding can be performed, but the package size cannot be reduced
Solution Approach 1:
The patent integrates the wire bonding area and supporting body bonding area into a single compact region, allowing both bonding operations to occur within the same peripheral edge area. This eliminates the need to secure a large substrate peripheral edge area, enabling package size reduction while maintaining ease of manufacture for both bonding processes.
Data Source
AI summary
An imaging device package includes: an imaging device chip; a substrate on which the imaging device chip is mounted; a wire that electrically connects the imaging device chip and the substrate at a peripheral edge of the substrate around the imaging device chip; a supporting body that supports an optical member with respect to the substrate; and a bonding section that bonds the supporting body to the substrate while sealing the wire and a bonding terminal of the wire at the peripheral edge of the substrate.