Radiation Imaging Panel Sealing to Prevent Warpage and Peeling
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Solution Overview
Problem
Conventional radiation imaging apparatuses face issues with warpage, peeling, and damage to sealing resin due to thermal expansion coefficient differences between the supporting base and sensor panel, leading to deteriorated image quality and increased cost and complexity.
Innovation Solution
A radiation imaging apparatus with a flexible sensor panel and a stress relaxation layer between the substrate and sensor panel, using materials with similar thermal expansion coefficients and a non-bonded structure to reduce stress and prevent moisture ingress, while utilizing a stress relaxation layer to mitigate thermal expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a base indicating the same thermal expansion coefficient as the sensor panel is provided to prevent warpage and peeling, then reliability is improved, but device complexity and cost increase
Solution Approach 1:
The patent removes the base component from the conventional structure and replaces it with a flexible sensor panel that directly contacts the sealing resin. This extraction eliminates the thermal expansion coefficient matching requirement while maintaining moisture resistance, thereby reducing device complexity and cost.
Solution Approach 2:
The patent changes the key parameter from thermal expansion coefficient matching to flexibility. By making the sensor panel flexible, it can accommodate thermal expansion differences without warpage or peeling, eliminating the need for a separate base component and simplifying the overall structure.
2Reliability
If a base indicating the same thermal expansion coefficient as the sensor panel is provided, then warpage and peeling are prevented, but manufacturing cost increases
Solution Approach 1:
The flexible sensor panel design extracts the base component from the structure, eliminating the need for expensive thermal expansion coefficient matching materials and reducing manufacturing complexity, thereby lowering production costs.
Solution Approach 2:
By changing from rigid thermal expansion matching to flexible accommodation, the patent simplifies material selection and manufacturing processes, reducing production costs while maintaining structural stability.
3Reliability
If a base indicating the same thermal expansion coefficient as the sensor panel is provided, then peeling is prevented, but apparatus weight increases
Solution Approach 1:
Removing the base component through the flexible sensor panel design eliminates unnecessary weight while maintaining layer bonding reliability through direct contact between the sensor panel and sealing resin.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves high-quality radiation images at low cost with a simple structure by preventing warpage and peeling, ensuring moisture resistance, and reducing the risk of sealing resin damage.
Implementation Method 1
a scintillator layer for converting radiation, such as an X-ray, into light having a wavelength detectable by the photoelectric conversion elements is stacked on the sensor panel
Implementation Method 2
The stress relaxation layer may be configured to relax stress caused between the substrate and the sensor panel
Implementation Method 3
The scintillator layer may be made of a material having deliquescence. In this case, there are cases in which moisture prevention is achieved for the scintillator layer by sealing the peripheral area of these components with resin
Data Source
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AI summary
A radiation imaging apparatus includes a scintillator layer configured to convert radiation into light, a supporting base (101) configured to support the scintillator layer (104), a sensor panel (110) including a plurality of photoelectric conversion elements arranged in a two-dimensional array, and a substrate (108), and the radiation imaging apparatus includes a sealing portion (111) configured to seal the sensor panel and the scintillator layer in a space formed between the substrate (108) and the supporting base (101), wherein the supporting base is made of metal, and a main material of the supporting base is same as a main material of the substrate.