Imaging Sensor Assembly High-Speed Data Transfer via Segmented PCBs
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Solution Overview
Problem
High-speed semiconductor inspection and metrology systems face challenges in data transfer due to design constraints on printed circuit boards (PCBs), including power dissipation, temperature stability, and fabrication complexities, which limit the performance and increase costs.
Innovation Solution
The implementation of an imaging sensor assembly with substrates and signal routing assemblies that include electrical interconnects, allowing for high-speed data transfer between imaging sensor packages and receiver packages, using flexible circuits and optical transceivers to separate high-speed data lines from power and control signals, reducing design complexity and increasing fabrication yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single main PCB is used to mount all imaging sensor packages and receiver packages, then the system has stable power supply and ground connections and reduced component count, but the PCB design becomes increasingly difficult and expensive due to high-speed data transfer requirements and fine design-rule requirements
Solution Approach 1:
The system divides the PCB into multiple separate PCBs, with each PCB mounting a subset of imaging sensor packages and receiver packages. This segmentation allows each individual PCB to have simpler high-speed signal routing and relaxed design rules compared to a single large PCB handling all signals. The segmentation principle directly addresses the contradiction by trading the centralized stability of a single PCB for the distributed simplicity of multiple PCBs.
2Speed
If multiple integrated circuit packages are mounted directly to the PCB with embedded signal lines, then the data transfer path is shortened, but the signal lines require high-speed communication channel signal drivers that increase power dissipation and temperature stability constraints
Solution Approach 1:
The patent introduces electrical interconnects as intermediary components between imaging sensor packages and receiver packages. These interconnects serve as external signal transmission media that replace the need for high-speed signal drivers integrated into the packages. By moving the signal transmission function to external interconnects, the system achieves high-speed data transfer without the power dissipation and thermal constraints associated with on-package high-speed drivers.
3Productivity
If high-density signal lines are routed on the PCB for high-speed data transfer, then the data transfer capability is improved, but the fabrication of PCB layers and assembly of connectors become increasingly difficult and error-prone
Solution Approach 1:
By segmenting the system into multiple PCBs with fewer signal lines each, the fabrication complexity of individual PCB layers is reduced. Each PCB requires fewer high-density interconnects, making the PCB fabrication process less difficult and less error-prone while still achieving the required overall data transfer capability through the distributed architecture.
Solution Approach 2:
Electrical interconnects serve as intermediary components that externalize the high-density signal routing from the PCB fabrication process. Instead of requiring the PCB itself to accommodate all high-density signals, the interconnects handle the high-speed data transfer functions, allowing the PCBs to be fabricated with standard, less complex routing patterns.
4Measurement precision
If dedicated integrated circuit packages are used for imaging sensors, then the sensor performance is optimized, but the signal drivers included in the packages have design constraints that limit system performance and degrade measurement signal quality
Solution Approach 1:
The patent extracts the signal driver function from the dedicated imaging sensor packages and relocates it to external electrical interconnects. This extraction removes the conflicting design constraints (power dissipation, temperature stability, spacing requirements) from the sensor packages themselves, allowing the sensors to operate at optimal performance while the external interconnects handle the signal transmission without degrading signal quality.
Data Source
AI summary
An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.