Imaging Sensor Gaps for Electronics Relocation
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Solution Overview
Problem
Current imaging sensors, especially in digital pathology, face challenges with low light sensitivity due to non-photosensitive parts reducing the fill factor and slow readout speeds, particularly when tilted, leading to oversampling and reduced image quality.
Innovation Solution
Incorporating non-photosensitive gaps between pixel lines to relocate readout electronics, allowing for increased fill factor and faster readout by positioning charge to voltage converters and other circuitry in these gaps, thus maximizing photoactive area and eliminating the need for microlenses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If readout electronics are embedded within each pixel, then pixel functionality is complete, but fill factor decreases and low light sensitivity is reduced
Solution Approach 1:
The sensor is divided into photosensitive pixel regions and non-photosensitive gap regions. Readout electronics are relocated from within each pixel to shared circuitry in the gap regions, segmenting the sensor into functional zones that optimize both fill factor and electronics integration
Solution Approach 2:
Readout electronics are moved from the two-dimensional pixel plane to gap regions between pixel lines, utilizing the third dimension of sensor structure (the space between active regions) to accommodate circuitry without reducing pixel area
2Productivity
If more readout electronics are provided, then readout speed increases, but pixel area available for light detection decreases
Solution Approach 1:
Multiple pixels share common readout electronics located in the gap regions, merging the readout functions of multiple pixels into shared circuitry. This reduces the total electronics area per pixel while maintaining fast readout capability through parallel processing of multiple pixel lines
3Reliability
If microlenses are applied to compensate for low light sensitivity, then light focusing is improved, but sensor tilt compatibility is reduced
Solution Approach 1:
The microlens layer is completely removed from the sensor design. Instead of using microlenses to focus light, the invention extracts this function by maximizing the fill factor through electronics relocation, allowing light to reach pixels directly without optical elements that would interfere with tilted sensor configurations
4Adaptability or versatility
If sensor is tilted for oblique cross-section imaging, then imaging capability is improved, but oversampling occurs and image quality decreases
Solution Approach 1:
The sensor design dynamically adapts to tilted configurations by using gap regions between pixel lines for electronics placement. This dynamic structural arrangement allows the sensor to maintain optimal performance in both tilted and non-tilted configurations, preventing oversampling artifacts while enabling oblique cross-section imaging
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances low light sensitivity and image quality while enabling faster image generation by maximizing the fill factor and allowing more circuitry on the sensor, particularly in tilted configurations.
Implementation Method 1
each pixel of the image sensor comprises a photodiode
Data Source
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AI summary
An imaging sensor comprising a 2D array of pixels in an XY coordinate system with gaps for electronic circuitry is presented. Furthermore, a scanning imaging system for imaging an oblique cross section of a sample with such a sensor is provided. Especially when the imaging sensor is in a tilted configuration this sensor is of specific advantages. The sensor allows for maximizing the photoactive part of the pixels in the photosensitive area of the sensor which leads to a maximized the fill factor. Furthermore this leads to a very light sensitive sensor and hence microlenses can be avoided. The gap or gaps of the imaging sensor facilitate also a faster read out because more circuitry can be positioned on the imaging sensor within the gap.