Imaging Device Sensor Signal Processing Chip Segmentation
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Solution Overview
Problem
The manufacturing process of imaging devices is complicated and costly due to the need to balance the performance of sensor units operating at high power supply voltage with signal processing units operating at low power supply voltage, leading to performance trade-offs such as insufficient miniaturization and reduced dynamic range.
Innovation Solution
An imaging device configuration with a sensor chip and multiple signal processing chips, where each chip is manufactured using optimal processes for its respective properties, featuring parallel data output from the sensor chip to multiple signal processing chips, and synchronized control units to manage A/D conversion and data transfer efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the sensor unit and signal processing unit are manufactured on a single chip using the manufacturing process suitable for the sensor unit, then the dynamic range is expanded, but the transistor miniaturization of the signal processing unit is insufficient leading to increased area and power consumption
Solution Approach 1:
The imaging device is divided into two separate chips: a sensor chip for the sensor unit and a signal processing chip for the signal processing unit. This segmentation allows each chip to be manufactured using optimized processes tailored to its specific requirements, enabling proper transistor miniaturization on the signal processing chip without compromising sensor performance.
Solution Approach 2:
A glass plate serves as an intermediary substrate that holds both the sensor chip and signal processing chip in close proximity. This intermediary structure enables the two chips to be manufactured separately with optimal processes while maintaining the electrical connections and spatial relationship needed for high-speed signal processing.
2Area of stationary object
If the sensor unit and signal processing unit are manufactured on a single chip using the manufacturing process suitable for the signal processing unit, then transistor miniaturization is achieved, but the dynamic range of the sensor unit is reduced
Solution Approach 1:
By segmenting the imaging device into separate sensor chip and signal processing chip, each component can be optimized independently. The sensor chip can use manufacturing processes that maximize dynamic range with appropriate transistor sizes, while the signal processing chip can use processes that achieve minimal transistor area for high-speed operation.
Solution Approach 2:
Different manufacturing process qualities are applied to different locations in the system. The sensor chip undergoes processes optimized for sensor performance (larger transistors for dynamic range), while the signal processing chip undergoes processes optimized for processing speed (smaller transistors for miniaturization).
3Use of energy by moving object
If the sensor unit operates at high power supply voltage to expand dynamic range, then the dynamic range is improved, but the signal processing unit requires low power supply voltage for high-speed operation creating complicated process control
Solution Approach 1:
Separating the sensor unit and signal processing unit into different chips eliminates the need for complex multi-voltage manufacturing control on a single chip. Each chip can be manufactured with its own optimized voltage requirements, simplifying the manufacturing process while maintaining both high dynamic range and high-speed processing capability.
4Productivity
If analog signals are output serially from the pixel array to the signal processing chip, then the device complexity is reduced, but the A/D conversion processing speed is slow
Solution Approach 1:
The data output structure is segmented into multiple parallel channels, with multiple data output terminals on the sensor chip corresponding to multiple data input terminals on the signal processing chip. This parallel architecture enables simultaneous A/D conversion of multiple pixel columns, dramatically increasing conversion speed.
Solution Approach 2:
The data transfer architecture transitions from a one-dimensional serial connection to a multi-dimensional parallel structure. Multiple data paths are established between the sensor chip and signal processing chip, allowing simultaneous transmission and conversion of multiple data streams in parallel.
Data Source
AI summary
An imaging device has a sensor chip and a signal processing chip. The sensor chip includes a pixel array in which a plurality of pixels are arranged in a 2-dimensional matrix and a data output terminal group made up of a plurality of data output terminals which output analog signals of pixels for each pixel column of the pixel array. The signal processing chip includes a data input terminal group electrically coupled to the data output terminal group, a plurality of A/D converters which convert analog signals of pixels received by the data input terminal group into digital signals for each pixel column of the pixel array, and a control unit which controls operation of the plurality of A/D converters.