Backside Imaging Sensor Layout for Via-Area Efficiency
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Solution Overview
Problem
In backside illumination type imaging devices, the region directly below the mounting section of the logic semiconductor element is a via-only region where circuit placement is not possible, leading to a decline in area efficiency.
Innovation Solution
The imaging device includes a semiconductor layer with a light reception region and a peripheral region, a through via, a first coupling section on the peripheral region for mounting a second semiconductor element, and a second coupling section for external substrate coupling, allowing for the formation of a desired wiring pattern and improving area efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through via is formed directly below the mounting section of the logic semiconductor element, then electrical connection between the sensor semiconductor element and logic semiconductor element is achieved, but area efficiency deteriorates due to the via-only region where circuit placement is not possible
Solution Approach 1:
The invention moves the coupling sections from the light reception surface (first surface) to the peripheral region on the opposite surface (second surface) of the sensor semiconductor element. This dimensional relocation allows the through via to serve dual purposes: electrical connection and structural support, while eliminating the via-only region constraint on the light reception surface and improving area efficiency.
Solution Approach 2:
The invention divides the coupling function into separate first and second coupling sections located on opposite surfaces of the sensor semiconductor element. The first coupling section on the light reception surface provides electrical connection, while the second coupling section on the peripheral region provides mechanical support and additional electrical connection, allowing independent optimization of each coupling function.
2Ease of manufacture
If the first coupling section and second coupling section are provided on the light reception surface, then mounting of the logic semiconductor element is enabled, but wiring pattern formation on the opposite surface is constrained
Solution Approach 1:
The invention relocates the coupling sections to opposite surfaces of the sensor semiconductor element, with the second coupling section positioned on the peripheral region of the second surface. This spatial separation enables independent wiring pattern formation on the light reception surface without being constrained by mounting requirements, simplifying the overall wiring design.
3Area of stationary object
If the width of the first coupling section is made wider than the through via, then mounting area for the logic semiconductor element is increased, but the via-only region constraint is exacerbated
Solution Approach 1:
The invention segments the coupling function across two separate coupling sections on opposite surfaces. The first coupling section on the light reception surface has a width matching the through via for precise electrical connection, while the second coupling section on the peripheral region of the second surface provides additional mounting area and mechanical support without creating via-only region constraints on the light reception surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the formation of a desired wiring pattern on the front surface side of the semiconductor layer, allowing for improved area efficiency and facilitating the mounting of additional semiconductor elements.
Implementation Method 1
a light reception region in which a plurality of photoelectric converters that performs photoelectric conversion on incident light is arranged
Data Source
AI summary
An imaging device according to an embodiment of the present disclosure includes: a semiconductor layer having one surface serving as a light incident surface and another surface opposed to the one surface, and having a light reception region and a peripheral region in the one surface, the light reception region in which a plurality of photoelectric converters that performs photoelectric conversion on incident light is arranged, and the peripheral region provided around the light reception region; a through via that penetrates between the one surface and the other surface; a first coupling section that is provided on the peripheral region on the one surface side, and has a width wider than the through via; a second coupling section that is provided on the peripheral region on the one surface side, and is used for coupling to an external substrate; a first semiconductor element including a coupling wiring line that electrically couples the first coupling section, the second coupling section, and the through via to one another; and a second semiconductor element that is mounted on the first semiconductor element by the first coupling section.