Imaging Device Substrate Exposed Conductor Heat Dissipation
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Solution Overview
Problem
Conventional imaging devices face inefficiencies in heat dissipation from image sensors due to the low thermal conductivity of solder-resist layers, which limits the transfer of heat to thermal transfer members, resulting in inadequate heat dissipation.
Innovation Solution
The imaging device incorporates an imaging element substrate with a stacked structure of insulating and conductor layers, featuring an exposed region with high thermal conductivity that is directly connected to the housing, allowing for efficient heat transfer without the insulating layer's thermal conductivity limitations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solder-resist layer is used to cover the dissipator region, then the insulating performance is improved, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The dissipator region is divided into a covered region (covered with insulating layer for electrical isolation) and an exposed region (exposed conductor layer for heat dissipation). This segmentation allows simultaneous achievement of electrical insulation and thermal management by assigning different functions to different sub-regions.
Solution Approach 2:
Different regions of the dissipator substrate are given different properties: the covered region provides electrical insulation, while the exposed region provides high thermal conductivity for heat dissipation. This local differentiation of material properties resolves the contradiction between insulation and heat dissipation requirements.
2Reliability
If the conductor layer is fully covered with insulating layer, then electrical isolation is improved, but thermal conduction deteriorates
Solution Approach 1:
The conductor layer is segmented into covered portions (for electrical isolation) and exposed portions (for thermal conduction). The exposed region allows heat to transfer efficiently to the housing while the covered regions maintain electrical isolation, thus resolving the contradiction between these two requirements.
Solution Approach 2:
The exposed conductor layer acts as an intermediary between the heat-generating imaging element and the housing, providing a thermal pathway while the insulating layer serves as an intermediary for electrical isolation. This dual-intermediary approach allows simultaneous achievement of both thermal and electrical management goals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective heat dissipation from the imaging element, reducing temperature rise and improving the device's thermal management capabilities.
Implementation Method 1
an exposed region in which the conductor layer is exposed from the insulating layer, and the exposed region is connected to the housing
Data Source
AI summary
Provided is an imaging device capable of efficiently dissipating heat from an imaging element. An imaging device 100 includes: an imaging element substrate 4 on which an insulating layer 51 and a conductor layer 52 are stacked and an imaging element 41 is mounted; and a housing 1 that accommodates the imaging element substrate 4. The surface of the imaging element substrate 4 has a mounting region 45 on which an electronic component 43 including the imaging element 41 is mounted, a covered region 46 in which the conductor layer 52 is covered with the insulating layer 51, and an exposed region 47 in which the conductor layer 52 is exposed from the insulating layer 51, and the exposed region 47 is connected to the housing 1.