Imaging Module Substrate Frame Thermal Expansion Matching
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Solution Overview
Problem
Conventional imaging device modules experience deformation due to differences in linear expansion coefficients between materials, leading to issues during manufacturing and in temperature-changing environments, affecting the light receiving surface's stability.
Innovation Solution
The imaging device module is designed with a substrate and frame where the linear expansion coefficients of the substrate and frame are carefully matched, with specific relationships between their coefficients at different temperatures, and the frame is attached at a temperature between the glass transition temperatures of the substrate and frame to minimize deformation, using a resin frame and adhesive agents with appropriate properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional materials are used for substrate and frame, then manufacturing is simplified, but warp occurs due to difference in linear expansion coefficients causing manufacturing and transportation problems
Solution Approach 1:
The patent changes the thermal expansion parameters by selecting specific material combinations where the frame material has a linear expansion coefficient (αf) closer to the substrate material than conventional designs. This parameter matching reduces differential thermal expansion stress, preventing substrate warp during manufacturing and transportation while maintaining ease of construction.
Solution Approach 2:
The patent employs composite material selection where the frame and substrate are made of materials with matched thermal expansion properties. This composite approach creates a thermally compatible structure that resists warp under temperature variations, solving both manufacturing simplicity and precision requirements simultaneously.
2Adaptability or versatility
If conventional materials with mismatched expansion coefficients are used, then material selection is easier, but large warp occurs in temperature-changing environments affecting light receiving surface accuracy
Solution Approach 1:
The patent modifies the thermal expansion parameters by selecting frame and substrate materials with matched linear expansion coefficients. This parameter optimization ensures that the imaging device maintains dimensional stability and light receiving surface accuracy across temperature changes, while still allowing practical material selection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces warp and deformation of the imaging device module across a wide temperature range, enhancing manufacturing stability and maintaining the light receiving surface's accuracy and precision.
Implementation Method 1
a relationship Tgp>Tgf, αf1<αPCB1, and αf2>αPCB2 is established, wherein Tgp is a glass transition temperature of the substrate, Tgf is a glass transition temperature of the frame, αPCB1 is a linear expansion coefficient in a planar direction of the substrate below the glass transition temperature Tgp, αf1 is a linear expansion coefficient of the frame below the glass transition temperature Tgf, αPCB2 is a linear expansion coefficient in a planar direction of the substrate above the glass transition temperature Tgp, and αf2 is a linear expansion coefficient of the frame above the glass transition temperature Tgf
Data Source
AI summary
According to the disclosure, a relationship of Tgp>Tgf, αf1<αPCB1, and (Tgp−To)×αPCB1<(Tgf−To)×αf1+(Tgp−Tgf)×αf2 or a relationship of Tgp<Tgf, αPCB1<αf1, and (Tgf−To)×αf1<(Tgp−To)×αPCB1+(Tgf−Tgp)×αPCB2 is satisfied, where linear expansion coefficients in an in-plane direction of the substrate at a temperature below a glass transition temperature Tgp of the substrate and at a temperature above the glass transition temperature Tgp of the substrate are denoted as αPCB1 and αPCB2, respectively, linear expansion coefficient of the frame at a temperature below a glass transition temperature Tgf of the frame and at a temperature above the glass transition temperature Tgf of the frame are denoted as αf1 and αf2, respectively, and a room temperature is denoted as To.