Imaging Device Substrate Groove and Adhesive Moistureproofing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Imaging devices face issues with moisture infiltration during the segmentation process, leading to potential film peeling, cracking, and dew condensation, which can deteriorate image quality due to inadequate moistureproof performance.
Innovation Solution
The implementation of a semiconductor device design that includes a first substrate between a transparent layer and a second substrate with a groove filled with an adhesive layer, where the side wall of the second substrate features both blade and stealth diced portions, enhancing moistureproof performance by reducing the risk of film peeling and cracking during the dicing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrate segmentation (dicing) is performed to manufacture multiple imaging devices, then productivity is improved, but film peeling and cracking occur leading to moisture infiltration
Solution Approach 1:
The groove is formed in the second substrate before the dicing process. This preliminary structural preparation allows the adhesive layer to be properly contained and bonded during subsequent segmentation, preventing film peeling and cracking that would otherwise occur during dicing. The groove acts as a pre-established protective structure that maintains moistureproof integrity even after substrate division.
Solution Approach 2:
The invention divides the substrate into multiple imaging devices through dicing while maintaining the groove structure that spans across segmentation lines. The groove is designed to extend through the second substrate and be filled with adhesive layer, creating continuous moisture barriers that remain effective even after the substrate is divided into separate devices. This allows productivity improvement through segmentation while preserving reliability.
2Reliability
If adhesive layer is applied to bond substrates, then moistureproof performance is improved, but film peeling may occur during dicing
Solution Approach 1:
The adhesive layer is selectively placed within the groove structure rather than being uniformly applied across the entire substrate surface. This localized placement ensures that the adhesive is contained in specific regions where it provides maximum moistureproof benefit while minimizing stress concentration points that could lead to peeling during dicing. The groove confines the adhesive to areas that do not interfere with the dicing process.
Solution Approach 2:
The groove structure serves as a cushioning element that absorbs and distributes stress during the dicing process. By providing a recessed space for the adhesive layer, the groove prevents the adhesive from creating rigid bonds that would be vulnerable to cracking during substrate division. The groove geometry is designed to accommodate thermal expansion and mechanical stress, protecting the adhesive bond integrity.
Data Source
AI summary
There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.