Imaging Device Substrate Groove Filling for Moistureproofing
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Solution Overview
Problem
Imaging devices face issues with moisture infiltration during the segmentation process, leading to potential film peeling, cracking, and dew condensation, which can cause image quality deterioration due to inadequate moistureproof performance.
Innovation Solution
The implementation of a semiconductor device design that includes a first substrate between a transparent layer and a second substrate, with an adhesive layer and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the same material as the adhesive layer, and the second substrate features both blade and stealth diced portions to enhance moistureproofing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrate segmentation is performed using conventional dicing methods, then manufacturing efficiency is improved, but moisture infiltration risk increases leading to film peeling and cracking
Solution Approach 1:
The patent applies preliminary action by forming the groove structure and filling it with adhesive material before performing the dicing operation. This pre-prepared moisture barrier structure ensures that when segmentation occurs, the adhesive material is already in position to prevent moisture infiltration, thus resolving the contradiction between maintaining manufacturing efficiency and improving moistureproof performance.
Solution Approach 2:
The patent introduces an intermediary substance (adhesive material) that fills the groove formed between substrates. This adhesive material acts as a mediator that prevents direct contact between moisture and the substrate interfaces, thereby preventing film peeling and cracking while allowing conventional dicing methods to be used for efficient manufacturing.
2Strength
If adhesive layer is applied to bond substrates, then bonding strength is improved, but moisture infiltration pathways are created at the adhesive edges
Solution Approach 1:
The patent uses the adhesive material as a flexible sealing film that fills the groove structure. This adhesive film conforms to the groove geometry and creates a continuous moisture barrier along the substrate interface, preventing moisture infiltration at the edges where the adhesive layer is applied, while maintaining bonding strength.
Solution Approach 2:
The patent transitions from a two-dimensional adhesive layer application to a three-dimensional groove-filling approach. By creating a groove and filling it with adhesive material, the solution adds a vertical dimension to the sealing structure, effectively blocking moisture infiltration pathways that would otherwise exist at the adhesive edges.
3Reliability
If groove structure is added to prevent moisture infiltration, then moistureproof performance is improved, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the sealing structure into distinct components: a groove structure and an adhesive material filling. This segmented approach allows the moisture barrier function to be implemented through a simple geometric modification (groove formation) combined with standard adhesive application, avoiding the need for complex multi-layer sealing systems while improving moistureproof performance.
Data Source
AI summary
There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.