Imaging Substrate Thermal Management via Segmented Heating and Insulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Devices with multiple interconnected parts experience thermal stress due to differing coefficients of thermal expansion, leading to potential cracking or deformation, which complicates maintaining electrical and mechanical integrity during temperature changes.
Innovation Solution
An apparatus featuring a low thermal expansion substrate with a recessed area and a heat-insulating platform, combined with a heating system and air flow management, allows for controlled temperature changes while maintaining a constant air temperature around the imaging lens, enabling unobstructed imaging of features over time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater is used to heat the substrate for thermal imaging, then temperature control is improved, but thermal stress and air temperature variation worsen
Solution Approach 1:
The substrate is divided into a heated zone (where the specimen is placed) and a non-heated zone (where the lens is positioned). The heater only heats the specimen area while the lens area remains at ambient temperature, eliminating thermal stress on the substrate and preventing air temperature variation around the lens.
Solution Approach 2:
A transparent heater is introduced as an intermediary element that allows light to pass through while providing localized heating. The transparent heater is positioned only in the specimen area, enabling temperature control of the specimen without affecting the lens area, thus resolving the contradiction between heating capability and thermal stress prevention.
2Temperature
If the substrate is heated uniformly, then temperature control is improved, but image quality worsens due to thermal distortion
Solution Approach 1:
The substrate heating is segmented into a localized heated region for the specimen and a non-heated region for the lens area. This segmentation allows temperature uniformity in the specimen zone while preventing thermal distortion in the imaging path, maintaining image quality.
Solution Approach 2:
Different regions of the substrate are given different thermal properties: the specimen area is heated with controlled temperature uniformity, while the lens area remains at ambient temperature. This local differentiation in thermal treatment ensures both temperature control for the specimen and image quality for the lens.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This setup minimizes thermal stress and maintains image quality by keeping the air temperature consistent between the lens and the substrate, allowing for precise imaging of features without distortion caused by thermal expansion mismatches.
Implementation Method 1
a heater configured to heat the zone of the substrate
Implementation Method 2
The substrate is supported on a heat insulating platform
Implementation Method 3
permits air to naturally flow between the heat insulating platform and substrate
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3B
AI summary
An apparatus for imaging a feature within a specimen is provided. According to one implementation the apparatus includes a substrate that is configured to support a specimen on an upper surface of the substrate so that the specimen resides over a hole that extends through the substrate. A heater is located vertically above the upper surface of the substrate. The heater is configured to heat the specimen when the specimen is supported on the substrate. An imaging device is located vertically below the lower surface of the substrate. The imaging device has an unobstructed line of sight to and through the hole in the substrate. The lower surface of the substrate is supported on a heat insulating platform in a manner that permits air to flow between the heat insulating platform and the lower surface of the substrate.