Imaging Substrate Asymmetry and Metal Bonding for Optical Alignment

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Solution Overview

Problem

Conventional imaging element mounting substrates face challenges in efficiently integrating imaging elements and electronic components while maintaining image clarity and preventing substrate deformation due to the increased demand for multi-functionality, leading to off-center imaging element mounting regions and potential lens housing stress issues.

Innovation Solution

The proposed solution involves an imaging element mounting substrate with an insulating substrate and a metal substrate, where the insulating substrate has distinct regions for imaging elements, electronic components, and a lens housing, with the metal substrate bonded to the bottom and positioned to overlap the fixed region between these areas, reducing stress and deformation by using high thermal conductivity materials and a bonding material to enhance bonding strength and electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If imaging elements and electronic components are mounted on the same substrate, then multi-functionality is achieved, but the imaging element mounting region shifts off-center causing optical axis deviation

Engineering Contradiction:

Improvemulti-functionalityVSAvoidoptical axis alignment

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The substrate is divided into distinct functional regions: a first mounting region for imaging elements, a second mounting region for electronic components, and a fixed region for lens housing. This segmentation allows each region to be optimized independently, maintaining the imaging element mounting region at the center for optical alignment while providing space for additional components elsewhere on the substrate.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The substrate design employs asymmetric region placement where the fixed region for lens housing is positioned between the first and second mounting regions, and the electronic components are arranged in an off-center second mounting region. This asymmetric layout balances the weight and stress distribution while keeping the imaging element mounting region centered, resolving the conflict between multi-functionality and optical axis alignment.

Inventive Principle:

Principle #4Asymmetry

2Adaptability or versatility

If the fixed region is positioned between mounting regions, then lens housing can be secured, but stress concentration may cause substrate deformation

Engineering Contradiction:

Improvelens housing integrationVSAvoidsubstrate structural integrity

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The substrate is constructed as a composite structure with a lower substrate and an upper substrate bonded together. The fixed region for lens housing is formed by the combined structure of both substrates, which distributes the mechanical stress from the lens housing across a larger area and through multiple material layers, preventing stress concentration and substrate deformation while maintaining the ability to secure the lens housing.

Inventive Principle:

Principle #40Composite materials

3Adaptability or versatility

If electronic components are mounted away from imaging elements, then functional separation is achieved, but substrate area increases

Engineering Contradiction:

Improvefunctional separationVSAvoidsubstrate area

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The substrate is designed as a multi-functional platform where a single upper substrate serves multiple purposes: providing a mounting surface for electronic components, contributing to the fixed region for lens housing, and bonding with the lower substrate to form a composite structure. This universal design achieves functional separation between imaging elements and electronic components while minimizing the overall substrate area through efficient space utilization.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves image clarity by reducing optical axis deviation, minimizes substrate cracking, and maintains the structural integrity of the imaging device by dispersing stress across the metal substrate, thereby enhancing the overall performance and reliability of the imaging module.

Implementation Method 1

a bonding material to enhance bonding strength

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS10261282B2Imaging element mounting substrate, imaging device and imaging module

Publication Date: 2019.04.16 KYOCERA CORP

AI summary

An imaging element mounting substrate may include an insulating substrate and a metal substrate. The insulating substrate may include a first mounting region for mounting an imaging element on a top surface, and a second mounting region located a distance away from the first mounting region for mounting one or more electronic components. The insulating substrate may include a fixed region for securing a lens housing surrounding the first mounting region. A metal substrate may be bonded to a bottom surface of the insulating substrate. A third mounting region located between the first mounting region and the second mounting region in the fixed region of the insulating substrate may be positioned with respect to the center of the insulating substrate in a plan view. The metal substrate may be located to overlap with the third mounting region and bestride the first mounting region and the second mounting region.