Imaging Unit Sealing Structure for Thin Gas-Resistant Packaging
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Solution Overview
Problem
Conventional imaging units with COB configurations face challenges in achieving thinness and superior resistance to liquid and gas, particularly sulfur dioxide gas, due to their packaging structures.
Innovation Solution
The proposed imaging unit incorporates a metal core substrate with multiple resin layers and metal layers, where the imaging chip is mounted on a protruding portion of the substrate, and a surrounding member with high water and gas resistance, effectively sealing the chip and preventing incursion of liquids and gases through the use of metal layers and seal materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a COB configuration is used to reduce packaging structure, then device complexity is reduced, but resistance to liquid and gas deteriorates
Solution Approach 1:
The sealing structure is divided into multiple segments: a protruding portion extending from the substrate, a surrounding member with sealing surface, and seal material filling the gap between them. This segmented approach provides effective liquid and gas resistance while maintaining a compact COB configuration without requiring complete encapsulation.
2Reliability
If conventional packaging structures are used to improve resistance to liquid and gas, then reliability is improved, but the imaging unit becomes thicker
Solution Approach 1:
The sealing approach transitions from vertical encapsulation (conventional packaging) to a horizontal protruding configuration. The protruding portion extends outward from the substrate surface, and the surrounding member seals around this protrusion, creating an effective seal in the radial direction rather than requiring increased thickness in the vertical direction.
3Reliability
If conventional packaging structures are used to improve resistance to liquid and gas, then reliability is improved, but device complexity increases
Solution Approach 1:
The sealing function is merged with the existing COB mounting structure. The protruding portion is integrated with the substrate, and the surrounding member with sealing surface is positioned to seal around this protrusion, combining the mounting and sealing functions into a unified structure that eliminates the need for separate encapsulation components.
Data Source
AI summary
An imaging unit comprising an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside. An imaging apparatus comprises an imaging unit that includes an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside.