Solid-State Imaging Device Wiring Redundancy
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Solution Overview
Problem
The increasing number of pixels and speed in image sensors leads to a high probability of wiring failures such as short circuits or disconnections due to the high density of wirings, and existing solutions like doubling selection transistors and signal lines result in significant area overhead.
Innovation Solution
A solid-state imaging device with a pixel array unit where one redundant wiring is provided for n number of signal lines, and redundant switches connect these signal lines to the redundant wiring, reducing the need for redundant circuits and area overhead.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If redundancy is increased to relieve wiring failure, then reliability is improved, but device complexity and area overhead increase
Solution Approach 1:
The pixel array is divided into multiple banks, with each bank containing a subset of pixels connected to shared signal lines. This segmentation allows redundancy to be applied at the bank level rather than individual pixel level, reducing overall complexity while maintaining reliability through bank-level failover capabilities.
Solution Approach 2:
Signal lines are designed to serve multiple functions by being shared across multiple pixels within a bank. The same signal line can transmit signals to different pixels depending on the operational state, and redundant signal lines can take over when primary lines fail, providing multi-functionality without requiring dedicated lines for each pixel.
2Productivity
If wiring density is increased to accommodate more pixels and functions, then productivity is improved, but reliability deteriorates due to higher failure probability
Solution Approach 1:
Multiple signal lines are merged into shared signal lines that serve multiple pixels within a bank. This consolidation reduces the total number of wiring lines required, allowing higher pixel density without proportionally increasing wiring complexity. The shared architecture maintains high productivity while reducing the statistical probability of wiring failures.
Solution Approach 2:
The system dynamically switches between primary and redundant signal lines based on operational needs and failure states. Control logic enables flexible routing of pixel signals through available pathways, allowing the system to adapt to wiring failures in real-time and maintain high productivity despite potential wiring issues in dense configurations.
3Reliability
If redundant circuits are added to provide detour paths, then reliability is improved, but area overhead increases
Solution Approach 1:
The pixel array is divided into multiple banks, with each bank containing a subset of pixels connected to shared signal lines. This segmentation allows redundancy to be applied at the bank level rather than individual pixel level, reducing overall complexity while maintaining reliability through bank-level failover capabilities.
Solution Approach 2:
Signal lines are designed to serve multiple functions by being shared across multiple pixels within a bank. The same signal line can transmit signals to different pixels depending on the operational state, and redundant signal lines can take over when primary lines fail, providing multi-functionality without requiring dedicated lines for each pixel.
Data Source
AI summary
The present technology relates to a solid-state imaging device and electronic apparatus capable of relieving wiring failure with less redundancy. The solid-state imaging device includes a pixel array unit in which a plurality of pixels is two-dimensionally arranged in a matrix, one redundant wiring provided for n number of signal lines that transmit a pixel signal from the pixels, and one or more redundant switches that connect one signal line and a redundant wiring. The present technology can be applied to, for example, a solid-state imaging device, or the like.