Solid-State Imaging Device Wiring Defect Correction
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Solution Overview
Problem
In solid state imaging devices, broken readout wirings lead to defective lines, especially in large-area photodetecting sections, causing resolution loss due to charge overflow and interpolation difficulties when three consecutive columns are affected.
Innovation Solution
A solid state imaging device with a correction processing section that corrects frame data by defining neighboring pixel portions and using voltage values from previous frames to calculate corrected voltage values, avoiding the need for normal line data, thus maintaining high resolution near defective lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If readout wirings are used to connect pixel portions to integration circuits, then charges can be read out from photodiodes, but broken readout wirings cause defective lines and charge overflow to neighboring columns
Solution Approach 1:
The patent detects charge overflow to neighboring columns as an indicator of wiring breakage and uses this harmful effect to identify defective lines. By monitoring the abnormal charge accumulation in neighboring columns, the system converts the harmful charge overflow into a useful diagnostic signal for detecting and correcting wiring failures.
Solution Approach 2:
The patent introduces a correction processing section that acts as an intermediary between the defective pixel portions and the final image output. This section detects wiring breakages through charge overflow patterns and applies interpolation algorithms to reconstruct the lost pixel data, mediating the impact of wiring failures on image quality.
2Loss of information
If conventional interpolation methods are used for defective lines, then some pixel data can be recovered, but resolution is lost when three consecutive columns are affected
Solution Approach 1:
The patent transitions from one-dimensional interpolation (using only horizontal neighboring pixels) to two-dimensional interpolation by incorporating vertical information from multiple frames. By utilizing temporal dimension (multiple frames) and vertical pixel relationships, the system can reconstruct defective horizontal lines without losing resolution, even when three consecutive columns are affected.
Solution Approach 2:
The patent performs preliminary detection of wiring breakages by monitoring charge overflow patterns before final image reconstruction. By identifying defective lines early through the charge overflow indicator and preparing correction data from neighboring frames in advance, the system can apply precise interpolation that maintains resolution rather than attempting correction after resolution loss has occurred.
3Area of stationary object
If large-area photodetecting sections are used, then imaging coverage is increased, but the probability of wire breakage increases due to longer readout wirings
Solution Approach 1:
The patent implements a self-diagnostic capability where the imaging system automatically detects wiring breakages through charge overflow patterns and performs self-correction using interpolation algorithms. The system serves itself by identifying and compensating for its own defects without external intervention, enabling large-area sensors to maintain reliability through autonomous defect management.
Solution Approach 2:
The patent establishes a feedback mechanism where charge overflow to neighboring columns provides information about wiring integrity. This feedback loop allows the system to continuously monitor readout wiring status and trigger correction processes when breakages are detected, enabling reliable operation of large-area photodetecting sections despite increased wiring length and breakage probability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-resolution image acquisition even with broken readout wirings by effectively interpolating pixel data, preventing resolution loss near defective lines.
Implementation Method 1
each including a photodiode which generates charges as much as an incident light intensity
Data Source
Figure 1
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AI summary
A solid state imaging device 1 includes a photodetecting section 10, a signal readout section 20, a controlling section 30, and a correction processing section 40. In the photodetecting section 10, M×N pixel portions each including a photodiode which generates charges as much as an incident light intensity and a readout switch connected to the photodiode are two-dimensionally arrayed in M rows and N columns. Charges generated in each pixel portion Pm,n are input into an integration circuit Sn through a readout wiring LO,n, and a voltage value output corresponding to the charge amount from the integration circuit Sn is output to an output wiring Lout through a holding circuit Hn. In the correction processing section 40, correction processing is performed for frame data repeatedly output from the signal readout section 20, and frame data after being subjected to the correction processing is output.