Imaging Wiring Layout With Notched Lines for Narrow-Gap Reliability
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Solution Overview
Problem
As semiconductor integrated circuit elements become finer, the reliability of imaging devices with narrower gaps between wiring lines is compromised, necessitating improved structural designs to enhance reliability.
Innovation Solution
An imaging device with a first wiring layer featuring notches at the ends of wiring lines and gaps between adjacent lines, covered by insulating films, to increase coverage and reduce electromigration defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the gap between wiring lines is narrowed to increase integration density, then the area is reduced, but the reliability deteriorates due to increased capacitance and electromigration defects
Solution Approach 1:
The patent divides the continuous wiring line into segments by forming gaps at specific positions (e.g., at notches or bends). This segmentation reduces the capacitance between adjacent wiring lines while maintaining the electrical connection function, thereby improving reliability without sacrificing integration density
Solution Approach 2:
The patent introduces an insulating film as an intermediary material between adjacent wiring lines. This insulating film acts as a mediator that reduces the capacitive coupling between wires, allowing narrower spacing while maintaining signal integrity and reducing electromigration effects
2Reliability
If the coverage of insulating film is increased to improve reliability, then the manufacturing complexity increases
Solution Approach 1:
The patent forms notches in the wiring line structure before depositing the insulating film. This preliminary action creates predefined coverage areas that guide the insulating film deposition process, ensuring complete coverage at critical locations (notches and gaps) while avoiding unnecessary material deposition elsewhere, thus managing manufacturing complexity
Solution Approach 2:
The patent applies insulating film coverage selectively at specific locations such as notches and gaps between wiring lines, rather than uniformly across the entire structure. This local quality approach ensures reliability at critical points while reducing overall material usage and manufacturing complexity
Data Source
AI summary
An imaging device according to an embodiment of the present disclosure includes: a first wiring layer; a first insulating film; and a second insulating film. The first wiring layer includes a plurality of first wiring lines that extends in one direction. The plurality of first wiring lines each has a notch at at least one of ends of one surface in a cross section orthogonal to an extending direction. The first insulating film covers a surface of the first wiring layer. The second insulating film is stacked on the first insulating film. The second insulating film forms a gap between the plurality of adjacent first wiring lines.