IME Board Securing With Thermally Conductive Polymer Interlock
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Solution Overview
Problem
Existing in-mold electronics (IME) processes face issues with LEDs and printed circuit boards detaching during use, leading to device failure, and there is a need for improved thermal management to extend service life.
Innovation Solution
A process involving the insertion of a board component into a mold, followed by injecting a thermally conductive thermoplastic polymer composition into a flow-through collar to secure the component, allowing it to flow over the board and form an in-mold electronics assembly, which includes features like through holes and vias, and removing it from the mold, which enhances thermal conductivity and mechanical interlock.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional in-mold electronics processes are used to assemble LEDs and printed circuit boards, then the assembly process is simple, but the components become detached during use resulting in device failure
Solution Approach 1:
The patent combines multiple functions into the polymer material itself: the polymer provides both structural support and thermal management capabilities. By integrating thermal conductivity enhancement directly into the polymer composition rather than adding separate thermal management components, the solution improves reliability while minimizing additional complexity.
Solution Approach 2:
The patent uses composite polymer materials enhanced with thermally conductive fillers (such as aluminum oxide, aluminum nitride, or boron nitride particles) to create a material that simultaneously provides mechanical attachment and thermal management. This composite approach resolves the contradiction by improving component security and thermal performance without requiring separate attachment mechanisms.
2Power
If high-power LEDs are used to increase power output, then the power output increases, but heat generation increases causing thermal management issues
Solution Approach 1:
The patent converts the harmful heat generated by high-power LEDs into a manageable parameter by incorporating thermally conductive fillers in the polymer material. These fillers (aluminum oxide, aluminum nitride, boron nitride) create thermal pathways that redirect heat away from the LED components, transforming the heat problem into a controlled thermal management solution that enables high-power operation without excessive temperature rise.
Solution Approach 2:
The patent changes the thermal parameters of the polymer material by adding thermally conductive fillers, thereby altering the heat dissipation characteristics of the entire assembly. This parameter change allows the system to maintain lower operating temperatures despite higher power input, resolving the contradiction between power output and temperature control.
3Ease of manufacture
If polymer material is used to secure board components in in-mold electronics assembly, then the assembly process is simplified, but the thermal management capability is insufficient
Solution Approach 1:
The patent transforms ordinary polymer material into a thermally management-capable composite by incorporating thermally conductive fillers such as aluminum oxide, aluminum nitride, or boron nitride particles. This composite material maintains the ease of manufacture benefits of polymer injection molding while adding the thermal management capability needed to handle high-power LED heat generation.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the polymer material through filler addition, enabling the material to perform both structural and thermal management functions. This parameter modification resolves the contradiction by maintaining manufacturing simplicity while achieving adequate thermal management capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process enhances the thermal conductivity and mechanical interlock of the assembly, ensuring the board component is securely attached and enhances thermal management.
Implementation Method 1
injecting a thermally conductive thermoplastic polymer composition into the mold and into a flow-through collar to flow over the board component
Data Source
AI summary
Provided is a process of securing a board component in an in-mold electronics assembly, the process comprising: inserting the board component into a mold; injecting a thermally conductive thermoplastic polymer composition into the mold and into a flow-through collar to flow over the board component which lies within an insert pocket in the in-mold electronics assembly; cooling the thermally conductive thermoplastic polymer composition securing the board component and forming the in-mold electronics assembly; and removing the in-mold electronics assembly from the mold, wherein the board component optionally includes one or more attachment openings, through holes, through-hole vias, blind vias, buried vias, microvias, stacked microvias, and any combination thereof allowing the thermally conductive thermoplastic polymer composition to flow therethrough.