Light-Releasable Imide Adhesive Tape for 300°C Electronic Processing
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Solution Overview
Problem
Conventional adhesive compositions and tapes used for electronic components fail to maintain adhesion during high-temperature processing (300° C. or higher) and result in adhesive deposits upon separation.
Innovation Solution
An adhesive composition comprising a reactive resin with an imide backbone and double bond-containing functional groups, along with silicone or fluorine compounds, which allows for easy separation by light irradiation after high-temperature processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional adhesive compositions are used for high-temperature processing (300°C or higher), then adhesion strength increases, but separation becomes difficult and adhesive deposits are generated
Solution Approach 1:
The patent applies parameter changes by incorporating a photopolymerizable functional group into the adhesive composition. This allows the adhesion strength to be dynamically controlled through light irradiation: the adhesive maintains strong bonding during high-temperature processing, then can be easily separated by irradiating with light to initiate polymerization and reduce adhesion. This transforms the adhesive's properties from static to controllable, resolving the contradiction between strong adhesion and easy separation.
2Reliability
If high-temperature processing (300°C or higher) is performed on electronic components with conventional adhesive, then metal film electroconductivity improves, but adhesive degradation occurs and adhesion rises
Solution Approach 1:
The patent applies preliminary action by equipping the adhesive composition with a photopolymerizable functional group before the high-temperature processing step. This functional group remains dormant during the sputtering process at 300-350°C, allowing the metal film to be formed with high electroconductivity. After the high-temperature processing is complete, light irradiation is applied to activate the photopolymerizable group, which then reduces adhesion for easy separation. The preliminary presence of the functional group enables the adhesive to withstand high-temperature processing without degradation.
3Ease of operation
If adhesive composition is designed for easy separation, then separation without damage is achieved, but adhesion strength during processing is insufficient
Solution Approach 1:
The patent applies dynamics by making the adhesive's bonding strength controllable and changeable. The adhesive composition contains a photopolymerizable functional group that allows the adhesion to be strong during high-temperature processing (when no light is applied) and then becomes easy to separate after light irradiation triggers polymerization. This dynamic control of adhesion strength resolves the contradiction between maintaining strong adhesion during processing and enabling easy separation afterward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition maintains adhesion during high-temperature processing and is easily separable without adhesive deposits, ensuring effective handling and protection of electronic components.
Implementation Method 1
The reactive resin having an imide backbone has remarkably excellent heat resistance and therefore is less likely to suffer degradation of the backbone even after high-temperature processing at 300° C. or higher
Implementation Method 2
owing to the double bond-containing functional group in a side chain or at an end of the reactive resin, the entire adhesive composition is uniformly and immediately polymerized and crosslinked by irradiation with light
Data Source
AI summary
The present invention aims to provide an adhesive composition that is easily separable by irradiation with light even after high-temperature processing at 300° C. or higher with an adherend fixed thereon, an adhesive tape including an adhesive layer formed of the adhesive composition, and a method for processing an electronic component. The present invention is an adhesive composition including: a reactive resin having an imide backbone and containing a double bond-containing functional group in a side chain or at an end; and a silicone compound or a fluorine compound.