Imide Skeleton Photocurable Adhesive for High-Temp Fixation
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Solution Overview
Problem
Conventional adhesive compositions and tapes used for electronic components fail to maintain sufficient adhesion during high-temperature processing at 300° C. or higher, often resulting in incomplete separation with adhesive deposits.
Innovation Solution
A temporary fixing material with a photocurable adhesive containing a reactive resin having an imide skeleton in its backbone repeating unit, which ensures high heat resistance and light transmittance, allowing for effective polymerization and crosslinking to reduce adhesion and prevent adhesive deposits during high-temperature processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional adhesive compositions or adhesive tapes are used to fix electronic components, then high adhesion is achieved during processing, but adhesion increases excessively during high-temperature processing at 300°C or higher, causing insufficient separation and adhesive deposits
Solution Approach 1:
The adhesive composition changes its adhesion parameters in response to temperature changes. During high-temperature processing (300°C or higher), the adhesion force increases to firmly fix the electronic component. Upon cooling, the adhesion force automatically decreases, enabling easy separation without adhesive deposits. This parameter change is achieved through the specific molecular structure and phase transition characteristics of the adhesive composition.
Solution Approach 2:
The adhesive composition exhibits dynamic adhesion characteristics that adapt to different temperature conditions. The adhesion strength is not static but dynamically adjusts based on the processing temperature, being strong during high-temperature processing and weak during separation at lower temperatures. This dynamic behavior resolves the contradiction between maintaining strong adhesion during processing and enabling easy separation afterward.
2Reliability
If high-temperature processing at 300°C or higher is performed with conventional adhesive, then thin metal film formation with higher electroconductivity is achieved, but adhesion rise occurs leading to adhesive deposits upon separation
Solution Approach 1:
The adhesive composition undergoes parameter changes based on temperature cycling. During high-temperature processing, it maintains stable adhesion to prevent component displacement while allowing the thin metal film to form with high electroconductivity. Upon cooling, the adhesion parameter changes to reduce strength, enabling clean separation without adhesive deposits on the electronic component surface.
Solution Approach 2:
The high-temperature processing that could potentially cause adhesive degradation is instead utilized to enhance adhesion temporarily. The adhesive is designed to withstand and even benefit from high temperatures during processing, then automatically becomes easily separable upon cooling. This converts the potentially harmful high-temperature effect into a beneficial mechanism for achieving both strong fixation during processing and clean separation afterward.
3Ease of manufacture
If photocurable adhesive with high light transmittance is used, then effective polymerization and crosslinking are achieved, but heat resistance may be insufficient leading to adhesion rise at high temperature
Solution Approach 1:
The adhesive composition is formulated as a composite system that combines the benefits of photocurable resins with high light transmittance and heat-resistant components. The composite structure allows effective UV polymerization for easy curing while incorporating thermally stable elements that maintain adhesion stability during high-temperature processing, preventing adhesion rise and adhesive deposits upon separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The temporary fixing material effectively maintains adhesion during high-temperature processing while ensuring easy separation without adhesive deposits, even after exposure to temperatures above 300° C.
Implementation Method 1
the photocurable adhesive uniformly and quickly polymerizes and crosslinks as a whole when irradiated with light
Implementation Method 2
a 5% weight loss temperature of 350° C. or higher
Data Source
AI summary
The present invention aims to provide a temporary fixing material that is easily separable even after high-temperature processing at 300° C. or higher with an adherend fixed thereon. The present invention also aims to provide a method for producing an electronic component using the temporary fixing material. Provided is a temporary fixing material containing a photocurable adhesive, the photocurable adhesive containing a reactive resin containing a resin (1) having an imide skeleton in a backbone repeating unit, the temporary fixing material having a light transmittance at 405 nm of 10% or greater and a 5% weight loss temperature of 350° C. or higher.